V. Chidambaram

发表

V. Chidambaram, Ho Beng Yeung, Gao Shan, 2012, Journal of Electronic Materials.

V. Chidambaram, K. Chuan, K. Y. Au, 2018, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Vivek Chidambaram, Gan Chee Lip, V. Chidambaram, 2014, Journal of Electronic Materials.

V. Chidambaram, K. Chuan, L. Bu, 2019, Journal of Electronic Materials.

V. Chidambaram, S. Wickramanayaka, 2015, Journal of Electronic Materials.

M. Kawano, V. Chidambaram, Qin Ren, 2019, 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).

V. Chidambaram, R. Yang, M. Shakerzadeh, 2019, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Mustafa S. Bakr, Deepesh Kumar Lall, P. Leek, 2022, 2210.04857.

Mustafa S. Bakr, Deepesh Kumar Lall, P. Leek, 2022, 2210.04857.

John Hald, Jesper Henri Hattel, Vivek Chidambaram, 2011 .

Mustafa S. Bakr, P. Leek, B. Vlastakis, 2021, 2107.11140.

M. Manfra, G. Gardner, V. Chidambaram, 2021, Physical Review Research.

V. Chidambaram, Ho Beng Yeung, Gao Shan, 2012, Journal of Electronic Materials.

John Hald, Jesper Henri Hattel, Vivek Chidambaram, 2009, Microelectron. Reliab..

Deepesh Kumar Lall, P. Leek, I. Rungger, 2023, Quantum Science and Technology.

V. N. Sekhar, Wang Xiangyu, V. Chidambaram, 2019, IEEE Journal of the Electron Devices Society.

M. Kawano, V. Chidambaram, Nicholas Wiswell, 2021, 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).

V. Chidambaram, S. Chong, Sharon Pei Siang Lim, 2021, 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).

V. Chidambaram, Ho Beng Yeung, Gao Shan, 2012, 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits.

V. Chidambaram, Qin Ren, Yew Wing Leong, 2020, Electronic Packaging Technology Conference.

Vivek Chidambaram, Ding Mian Zhi, Bu Lin, 2016, 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).

Y. Gu, V. Chidambaram, H. Ji, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Jong Ming Chinq, Kok Keng Chua, J. Alton, 2020, 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).