F. Sun

发表

Mengkuo Xu, F. Sun, Zhenya Pan, 2022, Soldering & Surface Mount Technology.

Guoqi Zhang, F. Sun, Yang Liu, 2018, Journal of Materials Science: Materials in Electronics.

W. V. van Driel, F. Sun, G.Q. Zhang, 2008, EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.

F. Sun, Lifeng Wang, Ying Liang, 2005, 2005 6th International Conference on Electronic Packaging Technology.

W. V. van Driel, F. Sun, G.Q. Zhang, 2008, 2008 International Conference on Electronic Packaging Technology & High Density Packaging.

F. Sun, Zuozhu Yin, Mengjiao Guo, 2019, Journal of Materials Science: Materials in Electronics.

Guoqi Zhang, F. Sun, Yang Liu, 2015, Journal of Electronic Materials.

Guoqi Zhang, F. Sun, Yang Liu, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).

F. Sun, Yang Liu, Tianhui Li, 2019, Materials Research Express.

F. Sun, Chi Zhang, B. Han, 2022, Soldering & Surface Mount Technology.

Guoqi Zhang, F. Sun, Yang Liu, 2017, Journal of Materials Science: Materials in Electronics.

F. Sun, Zuozhu Yin, Mengjiao Guo, 2018, Journal of Materials Science: Materials in Electronics.

F. Sun, Yang Liu, Hao Zhang, 2018, Journal of Materials Science: Materials in Electronics.

Xuejun Fan, Guoqi Zhang, F. Sun, 2018, IEEE Transactions on Device and Materials Reliability.

H. Ye, Xuejun Fan, F. Sun, 2021, Journal of Materials Research and Technology.

F. Sun, Yang Liu, L. Luo, 2013, 2013 14th International Conference on Electronic Packaging Technology.

Guojun Wang, F. Sun, Yang Liu, 2012, 2012 7th International Forum on Strategic Technology (IFOST).

F. Sun, Yang Liu, Hao Zhang, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).

F. Sun, Xiuqi Wang, Meiling Xin, 2022, Journal of Materials Science: Materials in Electronics.

F. Sun, Yang Liu, Zuozhu Yin, 2018, Soldering & Surface Mount Technology.

F. Sun, Yang Liu, Pengfei Zou, 2011, 2011 International Symposium on Advanced Packaging Materials (APM).

Jinyang Du, F. Sun, Xiuqi Wang, 2021, Soldering & Surface Mount Technology.

F. Sun, Yang Liu, Dongdong Zhu, 2019, Materials Research Express.

Xiaojing Liu, F. Sun, Yang Liu, 2010, International Forum on Strategic Technology 2010.

F. Sun, Y. Liu, T.L. Yan, 2008, 2008 International Conference on Electronic Packaging Technology & High Density Packaging.

F. Sun, Y. Liu, L. Wang, 2007, 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.

Yang Liu, Fenglian Sun, F. Sun, 2012, Journal of Materials Science: Materials in Electronics.

F. Sun, X. Kong, Miaosen Yang, 2015, International Conference on Electronic Packaging Technology.

Jian Wang, Yang Liu, Fenglian Sun, 2015, Journal of Materials Science: Materials in Electronics.

F. Sun, Yang Liu, Hao Zhang, 2019, Journal of Materials Science: Materials in Electronics.

Yang Liu, Fenglian Sun, F. Sun, 2014, Journal of Materials Science: Materials in Electronics.

F. Sun, Yang Liu, Xianghua Zeng, 2020, Journal of Materials Science: Materials in Electronics.

C. Qian, Jiajie Fan, Xuejun Fan, 2016, 2016 13th China International Forum on Solid State Lighting (SSLChina).

Yang Liu, Jia Zhao, G. Q. Zhang, 2014, Microelectron. Reliab..

F. Sun, Zuozhu Yin, Mengjiao Guo, 2019, Soldering & Surface Mount Technology.

F. Sun, Yang Liu, Hao Zhang, 2019, Materials Research Express.

F. Sun, Yang Liu, Zhang Tao, 2017, 2017 18th International Conference on Electronic Packaging Technology (ICEPT).

Yang Liu, Fenglian Sun, Pengfei Zou, 2012, Journal of Materials Science: Materials in Electronics.

Yang Liu, G. Q. Zhang, Hao Zhang, 2018, Microelectron. Reliab..

F. Sun, Yang Liu, Lifeng Wang, 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging.

Willem D. van Driel, G. Q. Zhang, F. Sun, 2008, Microelectron. Reliab..

Willem D. van Driel, Y. Liu, G. Q. Zhang, 2009, Microelectron. Reliab..

F. Sun, Yang Liu, Tianhui Li, 2019, Journal of Materials Science: Materials in Electronics.

Xuejun Fan, Guoqi Zhang, F. Sun, 2019, Soldering & Surface Mount Technology.

F. Sun, J. Fan, G. Ban, 2017, Journal of Materials Engineering and Performance.

F. Sun, Yang Liu, Hao Zhang, 2019, Journal of Materials Science: Materials in Electronics.

Yang Liu, Fenglian Sun, Guoqi Zhang, 2014, IEEE Transactions on Components, Packaging and Manufacturing Technology.

F. Sun, Yang Liu, Tianhui Li, 2019, Soldering & Surface Mount Technology.

F. Sun, Yang Liu, Hao Zhang, 2014, Journal of Materials Science: Materials in Electronics.

Mark D. Placette, Jiajie Fan, Xuejun Fan, 2019, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Cell K. Y. Wong, Xuejun Fan, Hongyu Tang, 2013, 2013 10th China International Forum on Solid State Lighting (ChinaSSL).