Yang Liu
发表
Mengkuo Xu,
F. Sun,
Zhenya Pan,
2022,
Soldering & Surface Mount Technology.
Guoqi Zhang,
F. Sun,
Yang Liu,
2018,
Journal of Materials Science: Materials in Electronics.
Microstructure Evolution and Shear Behavior of the Solder Joints for Flip-Chip LED on ENIG Substrate
Guoqi Zhang,
F. Sun,
Yang Liu,
2015,
Journal of Electronic Materials.
Guoqi Zhang,
F. Sun,
Yang Liu,
2016
.
Guoqi Zhang,
F. Sun,
Yang Liu,
2015,
2015 16th International Conference on Electronic Packaging Technology (ICEPT).
Guoqi Zhang,
F. Sun,
Yang Liu,
2015
.
Z. Li,
Guoqi Zhang,
F. Sun,
2019,
Journal of Electronic Materials.
F. Sun,
Yang Liu,
Tianhui Li,
2019,
Materials Research Express.
F. Sun,
Yang Liu,
Xianghua Zeng,
2020
.
Guoqi Zhang,
F. Sun,
Yang Liu,
2014,
Journal of Materials Science: Materials in Electronics.
Guoqi Zhang,
F. Sun,
Yang Liu,
2018,
Results in Physics.
Guoqi Zhang,
F. Sun,
Yang Liu,
2017,
Journal of Materials Science: Materials in Electronics.
F. Sun,
Yang Liu,
Hao Zhang,
2018,
Journal of Materials Science: Materials in Electronics.
Xuejun Fan,
Guoqi Zhang,
F. Sun,
2018,
IEEE Transactions on Device and Materials Reliability.
Rationally designed C/Co9S8@SnS2 nanocomposite as a highly efficient anode for lithium-ion batteries
Peng Zhang,
Minghua Chen,
F. Sun,
2020,
Nanotechnology.
J. Wang,
H. W. Zhang,
Yang Liu,
2015,
Microelectron. Reliab..
F. Sun,
Yang Liu,
J. Zhai,
2020
.
H. Ye,
Xuejun Fan,
F. Sun,
2021,
Journal of Materials Research and Technology.
Xuejun Fan,
Guoqi Zhang,
F. Sun,
2019,
Results in Physics.
F. Sun,
Yang Liu,
L. Luo,
2013,
2013 14th International Conference on Electronic Packaging Technology.
F. Sun,
Yang Liu,
X. Kong,
2016
.
Guojun Wang,
F. Sun,
Yang Liu,
2012,
2012 7th International Forum on Strategic Technology (IFOST).
Peng Zhang,
Yang Liu,
Penghui Chen,
2021,
Journal of Materials Science: Materials in Electronics.
F. Sun,
Yang Liu,
Hao Zhang,
2015,
2015 16th International Conference on Electronic Packaging Technology (ICEPT).
F. Sun,
Yang Liu,
Zuozhu Yin,
2018,
Soldering & Surface Mount Technology.
F. Sun,
Yang Liu,
Pengfei Zou,
2011,
2011 International Symposium on Advanced Packaging Materials (APM).
F. Sun,
Yang Liu,
Dongdong Zhu,
2019,
Materials Research Express.
Xiaojing Liu,
F. Sun,
Yang Liu,
2010,
International Forum on Strategic Technology 2010.
Yang Liu,
Fenglian Sun,
F. Sun,
2012,
Journal of Materials Science: Materials in Electronics.
H. Fang,
F. Sun,
Yang Liu,
2021
.
Jian Wang,
Yang Liu,
Fenglian Sun,
2015,
Journal of Materials Science: Materials in Electronics.
F. Sun,
Yang Liu,
Hao Zhang,
2019,
Journal of Materials Science: Materials in Electronics.
Yang Liu,
Xianghua Zeng,
Min Zhou,
2021,
Materials Research Express.
Weiguo Song,
F. Sun,
Yang Liu,
2019,
Results in Physics.
Yang Liu,
Fenglian Sun,
F. Sun,
2014,
Journal of Materials Science: Materials in Electronics.
Yang Liu,
Hongxia Li,
Jiann-Haur Chang,
2022,
Journal of Materials Science: Materials in Electronics.
Yang Liu,
Hongxia Li,
Min Zhou,
2021,
Soldering & Surface Mount Technology.
Yang Liu,
Penghui Chen,
Hao Zhang,
2021,
Welding International.
F. Sun,
Yang Liu,
R. Xu,
2019
.
F. Sun,
Yang Liu,
Hao Zhang,
2016
.
F. Sun,
Yang Liu,
Xianghua Zeng,
2020,
Journal of Materials Science: Materials in Electronics.
Z. Li,
Yang Liu,
Penghui Chen,
2021,
Journal of Materials Science: Materials in Electronics.
F. Sun,
Yang Liu,
Hao Zhang,
2019,
Modern Physics Letters B.
Yang Liu,
Jia Zhao,
G. Q. Zhang,
2014,
Microelectron. Reliab..
F. Sun,
Yang Liu,
Hao Zhang,
2019,
Materials Research Express.
Yang Liu,
Penghui Chen,
Xianghua Zeng,
2021,
Microelectronics Reliability.
Yang Liu,
Penghui Chen,
Xianping Zeng,
2021,
Journal of Materials Science: Materials in Electronics.
Yang Liu,
Penghui Chen,
Hao Zhang,
2021,
Welding International.
Xuejun Fan,
Guoqi Zhang,
F. Sun,
2020,
Applied Physics A.
F. Sun,
Yang Liu,
Jia Wang,
2011
.
Jiajie Fan,
F. Sun,
Yang Liu,
2017
.
F. Sun,
Yang Liu,
Hao Zhang,
2019,
Materials Letters.
F. Sun,
Yang Liu,
Zhang Tao,
2017,
2017 18th International Conference on Electronic Packaging Technology (ICEPT).
Yang Liu,
Fenglian Sun,
Pengfei Zou,
2012,
Journal of Materials Science: Materials in Electronics.
Yang Liu,
G. Q. Zhang,
Hao Zhang,
2018,
Microelectron. Reliab..
F. Sun,
Yang Liu,
Lifeng Wang,
2009,
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
Ping Liu,
Guoqi Zhang,
F. Sun,
2017
.
H. Fang,
F. Sun,
Yang Liu,
2021,
Journal of Nanoparticle Research.
Ping Liu,
Yang Liu,
Xiaolong Gu,
2016,
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
F. Sun,
Yang Liu,
Tianhui Li,
2019,
Journal of Materials Science: Materials in Electronics.
Yue Gao,
Zhi-Quan Liu,
Yang Liu,
2022,
Journal of Materials Science: Materials in Electronics.
Xuejun Fan,
Guoqi Zhang,
F. Sun,
2019,
Soldering & Surface Mount Technology.
F. Sun,
Yang Liu,
Hao Zhang,
2019,
Journal of Materials Science: Materials in Electronics.
Yang Liu,
Fenglian Sun,
Guoqi Zhang,
2014,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
F. Sun,
Yang Liu,
Tianhui Li,
2019,
Soldering & Surface Mount Technology.
F. Sun,
Yang Liu,
Hao Zhang,
2014,
Journal of Materials Science: Materials in Electronics.
Mark D. Placette,
Jiajie Fan,
Xuejun Fan,
2019,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
F. Sun,
Zhenya Pan,
Yang Liu,
2021
.
Cell K. Y. Wong,
Xuejun Fan,
Hongyu Tang,
2013,
2013 10th China International Forum on Solid State Lighting (ChinaSSL).
F. Sun,
Yang Liu,
Lifeng Wang,
2011,
Proceedings of 2011 6th International Forum on Strategic Technology.