Yang-Hsien Lee

Shear strength and interfacial microstructure of Sn–Ag–xNi/Cu single shear lap solder joints

Hwa-Teng Lee, Yang-Hsien Lee, 2007 .

Detection of soldering induced damages on crystalline silicon solar modules fabricated by hot-air soldering method

Keh-Moh Lin, Yang-Hsien Lee, W. Huang, 2015 .

Adhesive strength and tensile fracture of Ni particle enhanced Sn–Ag composite solder joints ☆

Hwa-Teng Lee, Yang-Hsien Lee, Hwa-Teng Lee, 2006 .

Microstructural Evolution of Sn-Ag-Sb Solder with Indium Additions

Hwa-Teng Lee, Yang-Hsien Lee, Yin-Fa Chen, 2009 .

Effects of in situ nickel particle addition on the microstructure and microhardness of Sn–Ag solder

Hwa-Teng Lee, Yang-Hsien Lee, 2005 .

Microstructure and mechanical properties of Sn-Ag-xNi composite solder

Yang-Hsien Lee, Yang-Hsien Lee, 2008, 2008 International Conference on Electronic Materials and Packaging.