Limin Ma
发表
Xitao Wang,
F. Guo,
Y. Zuo,
2013,
Journal of Materials Science.
K. N. Subramanian,
F. Guo,
Y. Zuo,
2016
.
F. Guo,
Y. Zuo,
Limin Ma,
2015,
Journal of Electronic Materials.
Liqiang Cao,
Hongwen He,
F. Guo,
2013,
2013 IEEE International Symposium on Advanced Packaging Materials.
L. Jia,
Hu Zhang,
Limin Ma,
2013
.
F. Guo,
Limin Ma,
Yishu Wang,
2019,
Journal of Materials Science: Materials in Electronics.
F. Guo,
Limin Ma,
Yishu Wang,
2019,
Journal of Electronic Materials.
F. Guo,
Limin Ma,
Yishu Wang,
2017,
2017 18th International Conference on Electronic Packaging Technology (ICEPT).
F. Guo,
Limin Ma,
Q. Hu,
2016,
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
L. Jia,
Hu Zhang,
Xiaoxia Tang,
2012
.
L. Jia,
Xiaoxia Tang,
H. Zhang,
2012
.
Xiaoxia Tang,
H. Zhang,
Limin Ma,
2012
.
F. Guo,
Limin Ma,
Yishu Wang,
2017,
2017 18th International Conference on Electronic Packaging Technology (ICEPT).
L. Jia,
Hu Zhang,
Limin Ma,
2012
.
L. Jia,
Hu Zhang,
Limin Ma,
2013
.
Limin Ma,
Wen-cong Zhang,
Wenzhen Chen,
2018,
Materials Science and Engineering: A.
Cheng Zhen,
Limin Ma,
Yishu Wang,
2022,
Materials & Design.
Jing Guo,
Limin Ma,
Jiping Lu,
2016
.
Wei Zhou,
Limin Ma,
Yishu Wang,
2022,
Journal of Solid State Chemistry.
F. Guo,
Y. Zuo,
Limin Ma,
2014
.
F. Guo,
Limin Ma,
Yishu Wang,
2019,
Journal of Electronic Materials.
F. Guo,
Limin Ma,
Yutian Shu,
2014,
2014 15th International Conference on Electronic Packaging Technology.
F. Guo,
Limin Ma,
Yishu Wang,
2017,
2017 18th International Conference on Electronic Packaging Technology (ICEPT).
F. Guo,
Y. Zuo,
Limin Ma,
2013,
2013 14th International Conference on Electronic Packaging Technology.
Wei Zhou,
Limin Ma,
Tong An,
2022,
Microelectronics Reliability.
F. Guo,
Limin Ma,
Yishu Wang,
2017,
2017 18th International Conference on Electronic Packaging Technology (ICEPT).
F. Guo,
Y. Zuo,
Limin Ma,
2017,
2017 18th International Conference on Electronic Packaging Technology (ICEPT).
F. Guo,
Y. Zuo,
Limin Ma,
2016
.
Xiaoxia Tang,
Limin Ma,
M. Gao,
2013
.
Ran Zhao,
F. Guo,
Y. Zuo,
2013,
Journal of Electronic Materials.
F. Guo,
Limin Ma,
Yishu Wang,
2018,
2018 19th International Conference on Electronic Packaging Technology (ICEPT).
Xiaoya Wang,
F. Guo,
Limin Ma,
2011,
2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.
F. Guo,
Limin Ma,
Q. Hu,
2020,
Journal of Materials Science: Materials in Electronics.
K. N. Subramanian,
F. Guo,
Limin Ma,
2013,
Journal of Electronic Materials.
Interactions between γ-TiAl melt and Y2O3 ceramic material during directional solidification process
Hu Zhang,
S. Gong,
Xiaoxia Tang,
2011
.
Liqiang Cao,
Hongwen He,
F. Guo,
2014,
2014 15th International Conference on Electronic Packaging Technology.
F. Guo,
Y. Zuo,
Limin Ma,
2014,
2014 15th International Conference on Electronic Packaging Technology.
Jianping Liu,
F. Guo,
Limin Ma,
2018,
Journal of Electronic Materials.
F. Guo,
Limin Ma,
Tong An,
2022,
Journal of Electronic Materials.
F. Guo,
Limin Ma,
Yishu Wang,
2020,
Journal of Electronic Materials.
Wei Zhou,
Limin Ma,
Yishu Wang,
2023,
Materials Chemistry and Physics.
Fu Guo,
Yan Wang,
Limin Ma,
2016,
Journal of Electronic Materials.
T. Bieler,
Quan Zhou,
F. Guo,
2018,
Journal of Electronic Materials.
K. N. Subramanian,
F. Guo,
Y. Zuo,
2014,
Journal of Electronic Materials.
F. Guo,
Y. Zuo,
Limin Ma,
2014,
Journal of Electronic Materials.
Shu Liu,
Limin Ma,
Yishu Wang,
2023,
Journal of Materials Science: Materials in Electronics.
Fu Guo,
Xitao Wang,
Limin Ma,
2011
.
Yu Tian,
Fu Guo,
Limin Ma,
2018,
Microelectron. Reliab..
G. Zou,
Hongqiang Zhang,
Limin Ma,
2022,
Applied Surface Science.
Xitao Wang,
F. Guo,
Y. Zuo,
2013
.
Hongwen He,
Haiyan Zhao,
Xitao Wang,
2012,
Journal of Electronic Materials.
Limin Ma,
Yishu Wang,
Wang Jiaojiao,
2021
.
F. Guo,
Limin Ma,
Xiaowei Wang,
2014,
2014 15th International Conference on Electronic Packaging Technology.
F. Guo,
Limin Ma,
Yishu Wang,
2018,
2018 19th International Conference on Electronic Packaging Technology (ICEPT).
Influence of nano-particles on creep behaviors of Cu/Sn-0.3Ag-0.7Cu-xPOSS/Cu composite solder joints
F. Guo,
Limin Ma,
Y. Hu,
2016,
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
F. Guo,
Limin Ma,
Yishu Wang,
2018,
Journal of Electronic Materials.
F. Guo,
Y. Zuo,
Limin Ma,
2015,
2015 16th International Conference on Electronic Packaging Technology (ICEPT).
F. Guo,
Y. Zuo,
Limin Ma,
2014,
2014 15th International Conference on Electronic Packaging Technology.
F. Guo,
Y. Zuo,
Limin Ma,
2015
.
Lu Yue,
F. Guo,
Limin Ma,
2012
.
F. Guo,
Limin Ma,
Yishu Wang,
2017,
Journal of Electronic Materials.
F. Guo,
Limin Ma,
Yishu Wang,
2017,
2017 18th International Conference on Electronic Packaging Technology (ICEPT).
F. Guo,
Limin Ma,
Yishu Wang,
2020,
Journal of Electronic Materials.
Xiaoxia Tang,
H. Zhang,
Limin Ma,
2011
.
G. Zou,
Hongqiang Zhang,
Limin Ma,
2023,
Materials letters (General ed.).
F. Guo,
Limin Ma,
Yishu Wang,
2018,
Journal of Materials Science: Materials in Electronics.
F. Guo,
Limin Ma,
Jianyu Feng,
2022,
Journal of Electronic Materials.