S. Lin

发表

H. Nishikawa, Shiqi Zhou, Chih-han Yang, 2019, Materials Science and Engineering: A.

Chih-han Yang, S. Lin, Chih-hao Chen, 2019, Materials Science and Engineering: A.

Chih-han Yang, S. Lin, H. Yang, 2019, Journal of Alloys and Compounds.

H. Nishikawa, Shiqi Zhou, Chih-han Yang, 2019, 2019 International Conference on Electronics Packaging (ICEP).

S. Lin, M. Tsai, Yu-Chen Liu, 2021, Materials Today Communications.

S. Lin, T. Hsu, Meng-Hung Tsai, 2023, Optics & Laser Technology.

Chih-han Yang, S. Lin, Yu-Chen Liu, 2022, 2022 International Conference on Electronics Packaging (ICEP).

Wei-hsin Chen, S. Lin, Yu-Chen Liu, 2022, International Journal of Energy Research.

S. Lin, D. Pelegov, R. N. Nasara, 2022, Batteries.

Sinn-wen Chen, Chao-hong Wang, S. Lin, 2007 .

S. Lin, D. Pelegov, C. Tu, 2019, Physical chemistry chemical physics : PCCP.

Sinn-wen Chen, S. Lin, W. Gierlotka, 2007 .

Sinn-wen Chen, Wojciech Gierlotka, Hsin-Jay Wu, 2012 .

Ngoc Thanh Thuy Tran, H. Pham, Ming-Fa Lin, 2019, Green Energy Materials Handbook.

S. Lin, Che‐an Lin, R. N. Nasara, 2021, ACS Sustainable Chemistry & Engineering.

O. Guillon, P. Kaghazchi, M. Finsterbusch, 2023, ACS applied materials & interfaces.

Ngoc Thanh Thuy Tran, O. Guillon, Y. Sohn, 2022, ACS applied materials & interfaces.

Chih-han Yang, S. Lin, Che-yu Yeh, 2019, 2019 International Conference on Electronics Packaging (ICEP).

S. Lin, Yi-Kai Kuo, Che-yu Yeh, 2016, 2016 International Conference on Electronics Packaging (ICEP).

Sinn-wen Chen, Chia-ming Hsu, S. Lin, 2014, Journal of Materials Science.

Sinn-wen Chen, Chia-ming Hsu, Chao-hong Wang, 2012 .

D. Morgan, R. Jacobs, S. Lin, 2019, MRS Communications.

S. Lin, Yu-Chen Liu, 2018, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).

Hsin-yi Lee, S. Lin, Yu-Chen Liu, 2017, Scientific Reports.

Masahiro Yoshimura, Wei Xie, Shih-kang Lin, 2013, Scientific Reports.

Sinn-wen Chen, Chia-ming Hsu, Che-wei Hsu, 2013 .

Sinn-wen Chen, Chia-ming Hsu, Che-wei Hsu, 2013 .

H. Nishikawa, Chih-han Yang, S. Lin, 2022, Science and Technology of Welding and Joining.

H. Nishikawa, Chih-han Yang, S. Lin, 2022, 2022 International Conference on Electronics Packaging (ICEP).

S. Lin, Ping‐chun Tsai, M. Tsai, 2014, Scientific Reports.

Shih‐Yang Lin, Ming-Fa Lin, S. Lin, 2014, Scientific Reports.

Chulmin Oh, Katsuaki Suganuma, Shijo Nagao, 2016, Scientific Reports.

Atsuo Yamada, Shih Kang Lin, A. Yamada, 2015 .

Ngoc Thanh Thuy Tran, Chih‐Long Tsai, Xin Lu, 2022, Journal of Materials Chemistry A.

C. Chang, S. Lin, M. Tsai, 2022, Materials letters (General ed.).

Junxiang Jiang, Katsuaki Suganuma, Keun-Soo Kim, 2007 .

Srikanth Gopalan, S. Lin, Y. Zhong, 2018, Ionics.

K. Suganuma, Hao Zhang, Chuantong Chen, 2016, China Semiconductor Technology International Conference.

K. Suganuma, Hao Zhang, Chuantong Chen, 2020 .

S. Lin, Che-yu Yeh, Hseng-ming Liao, 2018, International Conference on Electronic Packaging and iMAPS All Asia Conference.

H. Nishikawa, Chih-han Yang, S. Lin, 2023, International Conference on Electronics Packaging.

S. Lin, H. Chang, Cheng-liang Cho, 2013, Journal of Electronic Materials.

Ngoc Thanh Thuy Tran, S. Lin, Che-an Lin, 2023, ACS Sustainable Chemistry & Engineering.

O. Guillon, K. Kung, M. Finsterbusch, 2023, Journal of the European Ceramic Society.

Hsin-yi Lee, S. Lin, Yu-Chen Liu, 2017, 2017 International Conference on Electronics Packaging (ICEP).