C. J. Lee

The investigation of interfacial and crystallographic observation in the Ni(V)/SAC/OSP Cu solder joints with high and low silver content during thermal cycling test

Tao-Chih Chang, J. Duh, C. J. Lee, 2015, Journal of Materials Science: Materials in Electronics.

Roles of Cu in Pb-free solders jointed with electroless Ni(P) plating

J. Duh, C. J. Lee, C. Tseng, 2013 .

Retarding the Cu–Sn and Ag–Sn intermetallic compounds by applying Cu–xZn alloy on micro-bump in novel 3D-IC technologies

J. Duh, C. J. Lee, Wei-Yu Chen, 2015, Journal of Materials Science: Materials in Electronics.