R. Uang

Fine pitch low-cost bumping for flip chip technology

Hsun Hu, Szu-wei Lu, R. Uang, 1999, Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330).

Process-dependent Thermal-mechanical Analysis and Design of a Novel Nanowire-based Anisotropic Conductive Film Assembly

Hsien-Chie Cheng, Chieh-Sheng Lin, Hsien-Chie Cheng, 2006, 2006 International Microsystems, Package, Assembly Conference Taiwan.

Microchip Self-Assembly on a Substrate Using Plasma Treatment

Enboa Wu, R. Uang, Chia-Shou Chang, 2008, IEEE Transactions on Advanced Packaging.

Fabrication of Nanowire Anisotropic Conductive Film for Ultra-Fine Pitch Flip Chip Interconnection

Yung-Yu Hsu, R. Uang, Syh-Yuh Cheng, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Mechanical Properties Measurement of Nanowires Anisotropic Conductive Film by Nanoindentation Technique

T. Kuo, Hsien-Chie Cheng, R. Uang, 2006 .

On the Thermal–Mechanical Behaviors of a Novel Nanowire-Based Anisotropic Conductive Film Technology

Yung-Yu Hsu, Hsien-Chie Cheng, Chieh-Sheng Lin, 2009, IEEE Transactions on Advanced Packaging.

Mechanical material characterization of Co nanowires and their nanocomposite

Hsien-Chie Cheng, Jiong-Shiun Hsu, Hsien-Chie Cheng, 2008 .

Mechanical Process Simulation of a Novel Metal-Nanowire-Film-based Flip Chip Technology

R. Uang, J. Hsu, H. Cheng, 2008, 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference.

Process control of high density solder bumps by electroplating technology

W. Lo, Hsun Hu, Szu-wei Lu, 1999, Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330).