C. Tseng

发表

J. Duh, C. Tseng, S. Tsai, 2010, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.

T. Bieler, Tae-Kyu Lee, C. Tseng, 2013, Journal of Electronic Materials.

Douglas Yu, Chien-Fu Tseng, Chung-Shi Liu, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).