A. Margomenos

发表

High-Q evanescent-mode filters using silicon micromachining and polymer stereolithography (SL) processing

L. Katehi, W. Chappell, X. Gong, 2004, 2004 IEEE MTT-S International Microwave Symposium Digest (IEEE Cat. No.04CH37535).

Three dimensional integration and packaging using silicon micromachining.

A. Margomenos, 2003 .

Low-loss CPW on low-resistivity Si substrates with a micromachined polyimide interface layer for RFIC interconnects

G. Ponchak, L. Katehi, A. Margomenos, 2001 .

Isolation in three-dimensional integrated circuits

M. I. Herman, L. Katehi, K. Herrick, 2000, IMS 2000.

Wideband Si Micromachined Transitions for RF Wafer-Scale Packages

L. Katehi, A. Margomenos, Yongshik Lee, 2007, 2007 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems.

K and Ka-Band silicon micromachined evanescent mode resonators

L. Katehi, A. Margomenos, K. Sabet, 2007, 2007 European Microwave Conference.

Silicon micromachined interconnects for on-wafer packaging of MEMS devices

D. Peroulis, L.P.B. Katehi, A. Margomenos, 2001, 2001 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems. Digest of Papers (IEEE Cat. No.01EX496).

Fabrication and accelerated hermeticity testing of an on-wafer package for RF MEMS

L.P.B. Katehi, A. Margomenos, L. Katehi, 2004, IEEE Transactions on Microwave Theory and Techniques.

Scaling of GaN HEMTs and Schottky Diodes for Submillimeter-Wave MMIC Applications

Keisuke Shinohara, Thomas C. Oh, Miroslav Micovic, 2013, IEEE Transactions on Electron Devices.

Isolation in three-dimensional integrated circuits

Linda P. B. Katehi, M. I. Herman, Alexandros Margomenos, 2000, 2000 IEEE MTT-S International Microwave Symposium Digest (Cat. No.00CH37017).

GaN Technology for E, W and G-Band Applications

H. P. Moyer, A. Fung, A. Margomenos, 2014, 2014 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS).

70–105 GHz wideband GaN power amplifiers

M. Micovic, K. Shinohara, D. Chow, 2012, 2012 7th European Microwave Integrated Circuit Conference.

Wafer-level packaging method incorporating embedded thermal management for GaN-based RF front-ends

M. Micovic, K. Shinohara, E. Prophet, 2014, Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

X band highly efficient GaN power amplifier utilizing built-in electroformed heat sinks for advanced thermal management

M. Micovic, K. Shinohara, D. Chow, 2013, 2013 IEEE MTT-S International Microwave Symposium Digest (MTT).

Novel Asymmetric Slant Field Plate Technology for High-Speed Low-Dynamic Ron E/D-mode GaN HEMTs

M. Micovic, K. Shinohara, A. Schmitz, 2017, IEEE Electron Device Letters.

A Comparison of Si CMOS and SiGe BiCMOS Technologies for Automotive Radars

A. Margomenos, A. Margomenos, 2009, 2009 IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems.

Heterogeneous Wafer-Scale Circuit Architectures

Saeed Mohammadi, A. Margomenos, L. Katehi, 2007, IEEE Microwave Magazine.

92–96 GHz GaN power amplifiers

A. Margomenos, A. Kurdoghlian, P. J. Willadsen, 2012, 2012 IEEE/MTT-S International Microwave Symposium Digest.

Ultra-wideband three dimensional transitions for on-wafer packages

L.P.B. Katehi, A. Margomenos, L. Katehi, 2004, 34th European Microwave Conference, 2004..

Multiwafer vertical interconnects for three-dimensional integrated circuits

Yongshik Lee, L.P.B. Katehi, S. Mohammadi, 2006, IEEE Transactions on Microwave Theory and Techniques.

A monolithic RF-MEMS filter with continuously-tunable center-frequency and bandwidth

Dimitrios Peroulis, Hao-Han Hsu, D. Peroulis, 2011, 2011 IEEE 11th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems.