Shizhi Wang

Diffusion barrier properties of TiW between Si and Cu

Shizhi Wang, S. Suthar, Christine M Hoeflich, 1993 .

Barriers Against Copper Diffusion into Silicon and Drift Through Silicon Dioxide

Shizhi Wang, Shi-Qing Wang, Shi‐Qing Wang, 1994 .

ILD thermal stability in deep-submicron technologies: from thin to ultrathin dielectric films

David Hsu, Frank G. Shi, H. K. Kim, 1999, Advanced Lithography.

On Advanced Interconnect Using Low Dielectric Constant Materials as Inter-Level Dielectrics

T. Seidel, P. Vasudev, Shizhi Wang, 1996 .

Reactively sputtered TiN as a diffusion barrier between Cu and Si

Ki-Bum Kim, I. Raaijmakers, Shizhi Wang, 1990 .

Effect of Fe- and Si-Enriched Secondary Precipitates and Surface Roughness on Pore Formation on Aluminum Plate Surfaces During Anodizing

Shizhi Wang, Qingda Yang, Yuanzhi Zhu, 2014, Journal of Materials Engineering and Performance.

Thermal stability of α‐titanium in contact with titanium nitride

Shizhi Wang, L. Allen, 1996 .