O. Guiller

Through Silicon Capacitor co-integrated with TSV as an efficient 3D decoupling capacitor solution for power management on silicon interposer

A. Farcy, Y. Lamy, S. Joblot, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Modeling and Frequency Performance Analysis of Through Silicon Capacitors in Silicon Interposers

A. Farcy, Y. Lamy, S. Joblot, 2017, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Through Silicon Capacitor co-integrated with TSVs on silicon interposer

A. Farcy, J. Carpentier, Y. Lamy, 2014 .