A. la Manna

Interposer technology for high band width interconnect applications

G. Beyer, E. Beyne, J. de Vos, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Effects of packaging on mechanical stress in 3D-ICs

G. Beyer, E. Beyne, J. de Vos, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

3D stacking induced mechanical stress effects

G. Beyer, E. Beyne, J. de Vos, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Via-middle through-silicon via with integrated airgap to zero TSV-induced stress impact on device performance

G. Beyer, E. Beyne, A. Redolfi, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Process development to enable 3D IC multi-tier die bond for 20μM pitch and beyond

Doug C. H. Yu, K. Rebibis, G. Beyer, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Biocompatibility assessment of advanced wafer-level based chip encapsulation

Maaike Op de Beeck, Rita Vos, Eric Dy, 2010, 3rd Electronics System Integration Technology Conference ESTC.

Key elements for sub-50μm pitch micro bump processes

E. Beyne, J. De Vos, C. Gerets, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Measurements and Analysis of Substrate Noise Coupling in TSV-Based 3-D Integrated Circuits

Eric Beyne, Paul Marchal, Makoto Nagata, 2014, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Minimizing interposer warpage by process control and design optimization

M. Gonzalez, E. Beyne, Mikael Detalle, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Direct Cu to Cu Bonding and Alternative Bonding Techniques in 3D Packaging

T. Suga, G. Vakanas, A. la Manna, 2020, 3D Microelectronic Packaging.