M. Sippel
发表
M. Vossiek,
K. Lomakin,
S. Herold,
2019,
2019 IEEE MTT-S International Microwave Symposium (IMS).
J. Franke,
K. Lomakin,
M. Sippel,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
C. Körner,
M. Vossiek,
K. Lomakin,
2019,
2019 49th European Microwave Conference (EuMC).
K. Lomakin,
M. Sippel,
K. Helmreich,
2020,
2020 IEEE/MTT-S International Microwave Symposium (IMS).
K. Lomakin,
M. Sippel,
G. Gold,
2021,
2021 14th International Congress Molded Interconnect Devices (MID).
A. Hofmann,
N. Travitzky,
K. Lomakin,
2021,
Applied Sciences.
M. Sippel,
J. Franke,
B. Ottinger,
2022,
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
M. Sippel,
K. Lomakin,
K. Helmreich,
2017
.
K. Lomakin,
M. Sippel,
K. Helmreich,
2021,
2021 15th European Conference on Antennas and Propagation (EuCAP).
Martin Vossiek,
Klaus Helmreich,
Felix Distler,
2019,
IEEE Transactions on Microwave Theory and Techniques.
K. Lomakin,
M. Sippel,
K. Helmreich,
2019,
IEEE Microwave and Wireless Components Letters.
K. Lomakin,
M. Sippel,
G. Gold,
2022,
2022 14th German Microwave Conference (GeMiC).
K. Lomakin,
M. Sippel,
K. Helmreich,
2021,
European Microwave Conference.
J. Franke,
K. Lomakin,
M. Sippel,
2018
.
K. Lomakin,
M. Sippel,
G. Gold,
2022,
2022 52nd European Microwave Conference (EuMC).
K. Lomakin,
M. Sippel,
G. Gold,
2022,
2022 IEEE/MTT-S International Microwave Symposium - IMS 2022.
K. Lomakin,
M. Sippel,
K. Helmreich,
2020,
2020 14th European Conference on Antennas and Propagation (EuCAP).
M. Vossiek,
K. Lomakin,
S. Herold,
2019,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
K. Lomakin,
M. Sippel,
K. Helmreich,
2021,
2020 50th European Microwave Conference (EuMC).
Z. Tong,
M. Sippel,
K. Lomakin,
2018,
2018 48th European Microwave Conference (EuMC).
J. Franke,
M. Sippel,
K. Lomakin,
2018,
2018 11th German Microwave Conference (GeMiC).
J. Franke,
M. Sippel,
K. Lomakin,
2018,
2018 11th German Microwave Conference (GeMiC).
Joerg Franke,
Markus Ankenbrand,
Klaus Helmreich,
2018,
2018 13th International Congress Molded Interconnect Devices (MID).