S. Kamiya

发表

Prediction of strength and fatigue lifetime of MEMS structures with arbitrary shapes

O. Paul, J. Gaspar, T. Kawai, 2009, TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference.

A novel fatigue test with ramping stress amplitude to evaluate fatigue behavior of polysilicon thin films

O. Paul, J. Gaspar, S. Kamiya, 2010, 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS).

Effect of humidity and temperature on the fatigue behavior of polysilicon thin film

O. Paul, J. Gaspar, S. Kamiya, 2011 .

Study on Introduction of CO2 Free Energy to Japan with Liquid Hydrogen

S. Kamiya, M. Nishimura, Eichi Harada, 2015 .

Visualization and Modal Analysis of Guided Waves from a Defect in a Pipe

Takahiro Hayashi, Shoji Kamiya, Muhammad Nor Salim, 2009 .

Computational Simulation of Interlaminar Crack Extension in Angle-Ply Laminates due to Transverse Loading

H. Sekine, S. Kamiya, Y. Yagishita, 1998 .

Statistical Characterization of Fracture Strength and Fatigue Lifetime of Polysilicon Thin Films with Different Stress Concentration Fields

O. Paul, J. Gaspar, S. Kamiya, 2012 .

A comparative study of a new microscale technique and conventional bending techniques for evaluating the interface adhesion strength in IC metallization systems

Masaki Omiya, Takashi Suzuki, Shoji Kamiya, 2010 .

Evaluation of adhesion energy and its correlation to apparent strength for Cu/SiN interface in copper damascene interconnect structures

T. Suzuki, T. Nakamura, M. Nishida, 2015, 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM).

Local distribution of residual stress of Cu in LSI interconnect

M. Nishida, Hisashi Sato, S. Kamiya, 2014 .

Specimen size effect on elastic–plastic strength evaluation of interface between thin films

M. Nishida, Hisashi Sato, Chuantong Chen, 2014 .

Macroscopic and microscopic interface adhesion strength of copper damascene interconnects

T. Suzuki, T. Nakamura, M. Nishida, 2013, 2013 IEEE International Interconnect Technology Conference - IITC.

Development of Cu/Insulation Layer Interface Crack Extension Simulation with Crystal Plasticity

M. Nishida, Hisashi Sato, S. Kamiya, 2013 .

Statistical characterization of fatigue lifetime of polysilicon thin films

O. Paul, J. Gaspar, S. Kamiya, 2012 .

Fatigue lifetime prediction of arbitrarily-shaped MEMS structures made of polysilicon thin films

O. Paul, J. Gaspar, S. Kamiya, 2018, Microsystem Technologies.

A prediction scheme of the static fracture strength of MEMS structures based on the characterization of damage distribution on a processed surface

O. Paul, J. Gaspar, S. Kamiya, 2013 .

Identification of fatigue crack extension process in zero-tension cyclic stress test of polysilicon films

O. Paul, J. Gaspar, S. Kamiya, 2012, 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems (MEMS).

Finite fatigue lifetime of silicon under inert environment

O. Paul, S. Kamiya, J. Gaspar, 2011, 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems.

Adhesion energy of Cu/polyimide interface in flexible printed circuits

Masaki Omiya, Shoji Kamiya, S. Kamiya, 2007 .

Evaluation for interface strength fluctuations induced by inhomogeneous grain structure of Cu line in LSI Interconnects

M. Nishida, Hisashi Sato, Chuantong Chen, 2014 .

Effect of Surface Formation and Plastic Deformation Energy on Evaluation of Interface Adhesion Strength

S. Kamiya, 2012 .

Prediction of fatigue lifetime based on static strength and crack extension law - Fatigue test of mems materials becomes unnecessary

O. Paul, P. Ruther, J. Gaspar, 2008, 2008 IEEE 21st International Conference on Micro Electro Mechanical Systems.

Fracture Toughness Estimation of Thin Chemical Vapor Deposition Diamond Films Based on the Spontaneous Fracture Behavior on Quartz Glass Substrates

M. Saka, H. Abé, S. Kamiya, 1997 .

Specimen size effect of interface strength distribution induced by grain structure of Cu line

M. Nishida, Hisashi Sato, Chuantong Chen, 2013 .

A trial for micro-scale evaluation of adhesion strength around Cu metallization systems

S. Kamiya, M. Omiya, H. Arakawa, 2007 .

Annealing temperature dependent strength of polysilicon measured using a novel tensile test structure

O. Paul, P. Ruther, S. Kamiya, 2004, 17th IEEE International Conference on Micro Electro Mechanical Systems. Maastricht MEMS 2004 Technical Digest.

Hydrogen Liquefaction: A Review of the Fundamental Physics, Engineering Practice and Future Opportunities

T. Funke, J. Trusler, Saif Z. S. Al Ghafri, 2022, Energy & Environmental Science.

Effect of thermal residual stress on the interlaminar crack extension behavior in cross-ply laminates due to transverse loading

H. Sekine, S. Kamiya, Y. Yagishita, 1997 .

H. Sekine, S. Kamiya, 1993 .

The origin of fatigue fracture in single-crystal silicon

S. Kamiya, H. Izumi, T. Kita, 2022, Journal of Materials Science.

Microscale torsion test to investigate initial yielding phenomenon of a single crystal copper

T. Suzuki, T. Nakamura, S. Kamiya, 2015, Microscopy and Microanalysis.

Direct Measurement of the Adhesive Fracture Resistance of CVD Diamond Particles

M. Saka, H. Abé, S. Kamiya, 1997, Application of Fracture Mechanics in Electronic Packaging.

A multidimensional scheme of characterization for performance deterioration behavior of flexible devices under bending deformation

M. Koganemaru, Tomohito Sekine, S. Tokito, 2020 .

A study of prediction of static fracture strength of MEMS structure for strength design scheme

O. Paul, J. Gaspar, S. Kamiya, 2010 .

Fatigue lifetime prediction of arbitrarily-shaped MEMS structures made of polysilicon thin films

O. Paul, J. Gaspar, S. Kamiya, 2018, Microsystem Technologies.

Three-dimensional simulation of crack extension in brittle polycrystalline materials

S. Kamiya, H. Abé, S. Kamiya, 2000 .

Effect of WC-Co substrates pre-treatment and microstructure on the adhesive toughness of CVD diamond

E. Traversa, R. Polini, S. Kamiya, 2001 .

New diamond coating with finely crystallized smooth surface for the tools to achieve fine surface finish of non-ferrous metals

Masumi Saka, S. Kamiya, Hiroyuki Hanyu, 2003 .

Damage evolution and fatigue debonding of diamond films under repeated loading

J. C. Madaleno, J. Gracio, S. Kamiya, 2008 .

Fast Remaining Thickness Measurement Using a Laser Source Scanning Technique

M. Murase, M. N. Salim, S. Kamiya, 2012 .

LASER BASED MEASUREMENT OF PLATE THICKNESS USING A FUNDAMENTAL ANTISYMMETRIC MODE OF LAMB WAVE

M. Murase, M. N. Salim, S. Kamiya, 2010 .

Void formation by thermal stress concentration at twin interfaces in Cu thin films

Masumi Saka, Kouichi Maruyama, S. Kamiya, 2001 .

Grain-scale adhesion strength mapping of copper wiring structures in integrated circuits

Takeshi Nokuo, Masaki Omiya, Shinsuke Watanabe, 2013 .

Dry and semi-dry machining using finely crystallized diamond coating cutting tools

Masumi Saka, S. Kamiya, Hiroyuki Hanyu, 2003 .

Evaluation and Improvement of the Adhesive Fracture Toughness of CVD Diamond on Silicon Substrate

M. Saka, H. Abé, S. Kamiya, 2002 .

Fracture and Embedment Behavior of Brittle Submicrometer Spherical Particles Fabricated by Pulsed Laser Melting in Liquid Using a Scanning Electron Microscope Nanoindenter

N. Koshizaki, Y. Ishikawa, S. Kamiya, 2021, Nanomaterials.

High‐Strength Sub‐Micrometer Spherical Particles Fabricated by Pulsed Laser Melting in Liquid

N. Koshizaki, Y. Ishikawa, S. Kamiya, 2018, Particle & Particle Systems Characterization.

Safety design of compressed hydrogen trailers with composite cylinders

S. Kamiya, K. Oimatsu, K. Igashira, 2014 .

Cross comparison of fatigue lifetime testing on silicon thin film specimens

K. Sato, K. Takashima, T. Tsuchiya, 2011, 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems.

Seamless interpretation of the strength and fatigue lifetime of polycrystalline silicon thin films

Patrick Ruther, Oliver Paul, Shoji Kamiya, 2008 .

Process Temperature–Dependent Mechanical Properties of Polysilicon Measured Using a Novel Tensile Test Structure

O. Paul, P. Ruther, S. Kamiya, 2007, Journal of Microelectromechanical Systems.

A novel evaluation method for interfacial adhesion strength in ductile dissimilar materials

Masaki Omiya, Shoji Kamiya, S. Kamiya, 2008 .

A comparative study of the mechanical properties of PVD coatings evaluated by new techniques and conventional methods

Masumi Saka, Shoji Kamiya, Hideaki Nagasawa, 2004 .

The improvement of cutting performance in semi-dry condition by the combination of DLC coating and CVD smooth surface diamond coating

S. Kamiya, H. Hanyu, Y. Murakami, 2005 .

Local Interface Strength Evaluation for LSI Interconnect with Micron Resolution

T. Suzuki, M. Nishida, Chuantong Chen, 2011 .

A new systematic method of characterization for the strength of thin films on substrates—evaluation of mechanical properties by means of ‘film projection’

M. Saka, H. Abé, S. Kamiya, 2002 .

Residual stress distribution in the direction of the film normal in thin diamond films

M. Saka, H. Abé, S. Kamiya, 1999 .

Effect of hydrogen at room temperature on electronic and mechanical properties of dislocations in silicon

S. Kamiya, Y. Tokuda, H. Izumi, 2014 .

Electronic properties of dislocations introduced mechanically at room temperature on a single crystal silicon surface

S. Kamiya, Y. Tokuda, H. Izumi, 2012 .

Statistical evaluation of the strength of wear-resistant hard coatings

S. Kamiya, S. Amaki, H. Hanyu, 2007 .

Investigation of continuous deformation behavior around initial yield point of single crystal copper by using micro scale torsion test

M. Nishida, Chuantong Chen, S. Kamiya, 2016 .

Highly Efficient Extraction of Mechanical and Linear and Quadratic Piezoresistive Properties of Poly-Si Films using Wafer-Scale Microtensile Testing

O. Paul, J. Gaspar, S. Kamiya, 2009, 2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems.

HIGHLYEFFICIENTEXTRACTIONOFMECHANICAL AND LINEARAND QUADRATICPIEZORESISTIVE PROPERTIESOFPOLY-SIFILMS USINGWAFER-SCALEMICROTENSILETESTING

J. Gaspar, S. Kamiya, J. Held, 2009 .

Crystal orientation effect on local adhesion strength of the interface between a damascene copper line and the insulation layer

M. Nishida, S. Kamiya, Tomoji Nakamura, 2014 .

The Simulation of Damage Extension in Continuous Fiber-Reinforced Cross-Ply Laminates

H. Sekine, S. Kamiya, 1991 .

Shear stress enhanced fatigue damage accumulation in single crystalline silicon under cyclic mechanical loading

A. Udhayakumar, S. Kamiya, H. Izumi, 2016 .

Defect accumulation and strength reduction in single crystalline silicon induced by cyclic compressive stress

S. Kamiya, H. Izumi, T. Kita, 2014 .

Direct observation of damage accumulation process inside silicon under mechanical fatigue loading

T. Tokoroyama, N. Umehara, S. Kamiya, 2013, 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII).

Scenario for catastrophic failure in interconnect structures under chip package interaction

Takeshi Nokuo, Masaki Omiya, Takashi Suzuki, 2015, 2015 IEEE International Reliability Physics Symposium.

Effects of Methane Concentration in the Deposition Process on the Crystal Structure and the Adhesive Fracture Toughness of CVD Diamond

M. Saka, H. Abé, Michiyoshi Tanaka, 2004 .