Hanwool Yeon

Electromigration behavior of advanced metallization on the structural effects for memory devices

Young‐Chang Joo, Kyung-Tae Jang, Yong-Jin Park, 2016 .

Graphene as an atomically thin barrier to Cu diffusion into Si.

Chandreswar Mahata, Juree Hong, Sanggeun Lee, 2014, Nanoscale.

One-step structure modulation of electrospun metal-loaded carbon nanofibers: Redox reaction controlled calcination

Young‐Chang Joo, Ji-Hoon Lee, Hanwool Yeon, 2015 .

Cu Contamination of the nMOSFET in a 3-D Integrated Circuit under Thermal and Electrical Stress

Young‐Chang Joo, Dohyun Baek, Hanwool Yeon, 2012 .

Effects of film thickness and deposition rate on the diffusion barrier performance of titanium nitride in Cu-through silicon vias

Young‐Chang Joo, Hoo-Jeong Lee, Hanwool Yeon, 2014, Electronic Materials Letters.