J. Kleff
发表
H. Reichl,
G. Engelmann,
H. Oppermann,
2011,
2011 IEEE 13th Electronics Packaging Technology Conference.
J. Kleff,
Daquan Yu,
M. Hutter,
2009
.
H. Reichl,
J. Kleff,
W. Muller,
2009,
2009 11th Electronics Packaging Technology Conference.
F. Krismer,
B. Michel,
J. Kolar,
2017,
2017 IEEE International Electron Devices Meeting (IEDM).