V. Nagaraj

Flip chip back end design parameters to reduce bump electromigration

D. Agonafer, S. Karajgikar, V. Nagaraj, 2008, 2008 58th Electronic Components and Technology Conference.

In-situ moisture desorption characterization of epoxy mold compound

V. Nagaraj, Xuejun Fan, 2012, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

Finite element modeling of anomalous moisture diffusion with dual stage model

V. Nagaraj, Xuejun Fan, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

MATERIAL CHARACTERIZATION OF BIMETALLIC TUBE USING FRICTION STIR EXTRUSION PROCESS

M. Naresh, V. Nagaraj, 2019 .

Effect of flip chip package architecture on stresses in the bump passivation opening

D. Agonafer, S. Karajgikar, V. Nagaraj, 2009, 2009 59th Electronic Components and Technology Conference.

Static Behavior of Pultruded GFRP Beams

Hota V. S. GangaRao, V. Nagaraj, V. Nagaraj, 1997 .