Seung-Hyun Chae

发表

Effects of UBM thickness, contact trace structure and solder joint scaling on electromigration reliability of Pb-free solder joints

J. Im, P. Ho, Seung-Hyun Chae, 2008, 2008 58th Electronic Components and Technology Conference.

Investigation of Intermetallic Compound Growth Enhanced by Electromigration in Pb-Free Solder Joints

J. Im, P. Ho, Xuefeng Zhang, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Mechanism of void formation in Cu post solder joint under electromigration

C. Kim, Minyoung Kim, Seung-Hyun Chae, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing

Paul S. Ho, Xuefeng Zhang, Jang-Hi Im, 2007 .

Effect of intermetallic formation on electromigration reliability of TSV-microbump joints in 3D interconnect

Tengfei Jiang, P. S. Ho, T. Bonifield, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Intermetallic Compound Growth and Stress Development in Al-Cu Diffusion Couple

C. Kim, L. Nguyen, Seung-Hyun Chae, 2017, Journal of Electronic Materials.

Effect of backside scratch direction on the Si die strength

P. Ho, D. Edwards, Jie-Hua Zhao, 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Kinetic Analysis of Electromigration Enhanced Intermetallic Growth and Void Formation in Pb-Free Solders

P. Ho, Xuefeng Zhang, Seung-Hyun Chae, 2007, 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.

Electromigration and thermomigration reliability of lead-free solder joints for advanced packaging applications

Seung-Hyun Chae, 2010 .

Electromigration Reliability of Pb-Free Solder Joints

P. Ho, Seung-Hyun Chae, Yiwei Wang, 2012 .

Recent advances on kinetic analysis of electromigration enhanced intermetallic growth and damage formation in Pb-free solder joints

Xuefeng Zhang, Paul S. Ho, Brook Huang-Lin Chao, 2009, Microelectron. Reliab..

Electromigration enhanced intermetallic growth and void formation in Pb-free solder joints

Paul S. Ho, Min Ding, Seung-Hyun Chae, 2006 .

Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages

K. Lu, P. Ho, Xuefeng Zhang, 2006 .

Electromigration lifetime statistics for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages

K. Lu, P. Ho, Xuefeng Zhang, 2006, 56th Electronic Components and Technology Conference 2006.

Effects of Sn grain structure on the electromigration of Sn−Ag solder joints

Paul S. Ho, Seung-Hyun Chae, Jay Im, 2012 .

Current Carrying Capability of Sn0.7Cu Solder Bumps in Flip Chip Modules for High Power Applications

P. Ho, Jin-wook Jang, Seung-Hyun Chae, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Kinetic study of intermetallic growth and its reliability implications in Pb-free Sn-based microbumps in 3D integration

J. Im, P. Ho, Seung-Hyun Chae, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Kinetic Analysis of Current Enhanced Intermetallic Growth and Its Effect on Electromigration Reliability of Solder Joints

K. Lu, P. Ho, Xuefeng Zhang, 2006, 2006 IEEE International Reliability Physics Symposium Proceedings.

Characterization of the Viscoelasticity of Molding Compounds in the Time Domain

Paul S. Ho, Darvin R. Edwards, Seung-Hyun Chae, 2010 .

Effect of Dicing Technique on the Fracture Strength of Si Dies With Emphasis on Multimodal Failure Distribution

Seung-Hyun Chae, P. Ho, D. Edwards, 2010, IEEE Transactions on Device and Materials Reliability.