L. Walsh

发表

Characterization of Copper Diffusion into Al and Al-1% Si Polycrystalline Thin Films

K. MacWilliams, G. Ramseyer, L. Walsh, 1995 .

Quantitative Three-Dimensional Characterization of the Morphology of Stressed and Electromigrated Aluminum Lines

G. Ramseyer, L. Walsh, J. Beasock, 1995 .

Characterization of Films Formed during the Corrosion of Copper in Dilute Solutions of Cupric Chloride

L. Walsh, N. Feilchenfeld, 1995 .

Thermal and Electromigration Effects on the Surface and Aluminum/Aluminum Oxide Interface of Aluminum Metallizations

G. Ramseyer, L. Walsh, J. Beasock, 1993 .

Effect of Microstructure on the Dissolution Kinetics of Copper Thin Films in Dilute Aqueous Solutions of Cupric Chloride

J. A. Schwarz, L. Walsh, N. Feilchenfeld, 1993 .

The interaction of polycrystalline copper films with dilute aqueous solutions of cupric chloride

L. Walsh, 1989 .

AFM/SEM study of thermally induced hillock coalescence

L. Walsh, J. Beasock, J. Chaiken, 1994 .

Copper Diffusion Into Aluminum-Silicon Metallizations by Accelerated Thermal and Electrical Stressing

G. Ramseyer, R. Lacoe, S. Brown, 1996 .