F. Duval

发表

H. Philipsen, B. Swinnen, D. Tezcan, 2009, 2009 59th Electronic Components and Technology Conference.

E. Beyne, P. Jaenen, H. Philipsen, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

E. Beyne, Y. Civale, P. Soussan, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

R. A. Miller, K. Rebibis, G. Beyer, 2014, 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).

K. Rebibis, E. Beyne, P. Bex, 2017, 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition.

F. Inoue, K. Rebibis, Andy Miller, 2016, 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).

R. A. Miller, K. Rebibis, E. Beyne, 2015, 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).

K. Rebibis, E. Beyne, B. Swinnen, 2012, 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).

R. A. Miller, K. Rebibis, G. Beyer, 2013, 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).

E. Beyne, B. Vandevelde, B. Majeed, 2010, 2010 12th Electronics Packaging Technology Conference.

E. Beyne, K. Croes, M. Stucchi, 2021, IEEE Transactions on Components, Packaging and Manufacturing Technology.

E. Beyne, D. Velenis, X. Sun, 2014, Proceedings of the 5th Electronics System-integration Technology Conference (ESTC).

Andy Miller, E. Beyne, C. Adelmann, 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

E. Beyne, K. Croes, M. Stucchi, 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

Eric Beyne, Andy Miller, John Slabbekoorn, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

F. Inoue, K. Rebibis, G. Beyer, 2019, 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).

K. Rebibis, Andy Miller, E. Beyne, 2015, 2015 IEEE CPMT Symposium Japan (ICSJ).

F. Inoue, Andy Miller, G. Beyer, 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

Eric Beyne, Rahul Agarwal, Philippe Soussan, 2009, 2009 IEEE International Conference on 3D System Integration.