J. Zaveri

A 'mesh' seed layer for improved through-silicon-via fabrication

M. Bakir, H. Yang, C. King, 2010 .

Coupled electrical and thermal 3D IC centric microfluidic heat sink design and technology

M. Bakir, Yue Zhang, C. King, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Electrical and fluidic C4 interconnections for inter-layer liquid cooling of 3D ICs

Muhannad S. Bakir, James D. Meindl, Calvin R. King, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).