J. Hung

300mm size ultra-thin glass interposer technology and high-Q embedded helical inductor (EHI) for mobile application

C. T. Wang, Doug C. H. Yu, C. Tsai, 2013, 2013 IEEE International Electron Devices Meeting.

Various Fatigue Testing of Polycrystalline Silicon Microcantilever Beam in Bending

J. Hung, Y. Guu, Hocheng Hong, 2008 .

Torsion Fatigue Testing of Polycrystalline Silicon Cross-Microbridge Structures

Hong Hocheng, Kazuo Sato, H. Hocheng, 2011 .

High performance passive devices for millimeter wave system integration on integrated fan-out (InFO) wafer level packaging technology

C. S. Liu, Wei-Heng Lin, Chung-Hao Tsai, 2015, 2015 IEEE International Electron Devices Meeting (IEDM).

Frequency effects and life prediction of polysilicon microcantilever beams in bending fatigue

Hong Hocheng, H. Hocheng, J. Hung, 2012 .