A. Sundarrajan

Electrical parametric and reliability of 5×50um TSVs for 3D IC

B. Bhushan, S. Ramaswami, Niranjan Kumar, 2014, IEEE International Interconnect Technology Conference.

CPI Parametric Investigation of UBM-Al Interface for Cu Pillar Flip-Chip Application

R. Balamurugan, A. Sundarrajan, Junqi Wei, 2016, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Under-Bump Metallization Contact Resistance ( $R_{c}$ ) Characterization at 10- $\mu \text{m}$ Polymer Passivation Opening

G. H. See, B. Bhushan, K. Chui, 2017, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Kinetic undercooling in solidification of a hypereutectic Al-Si alloy; Effect of solidifying within a ceramic preform composite

A. Mortensen, M. Flemings, A. Sundarrajan, 1998 .

Thermal expansion behavior of particulate metal-matrix composites

A. Sundarrajan, S. Elomari, M. Skibo, 1998 .

Studies on tanning with zirconium oxychloride: Part II: Development of a versatile tanning system

B. Nair, A. Sundarrajan, J. Rao, 2003 .

Studies on tanning with zirconium oxychloride: Part I: Standardization of tanning process

B. Nair, A. Sundarrajan, J. Rao, 2003 .

Low Temperature Cu-Cu Bonding with Electroless Deposited Metal Passivation for Fine-Pitch 3D Packaging

Kuan-Neng Chen, Hsin-Chi Chang, Han-Wen Hu, 2021, 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).

Solidification behavior of Al-30 wt% Si in the presence of continuous alumina fibers

A. Sundarrajan, 1996 .

Metallization of sub-30 nm interconnects: Comparison of different liner/seed combinations

G. Beyer, K. Devriendt, N. Heylen, 2009, 2009 IEEE International Interconnect Technology Conference.