B. Chan

Terabit/s-Class Optical PCB Links Incorporating 360-Gb/s Bidirectional 850 nm Parallel Optical Transceivers

C. Schow, C. Tsang, J. Knickerbocker, 2012, Journal of Lightwave Technology.

Development of two-metal layer flexible substrate for high density IC packaging

T. Lee, B. Chan, C. Q. Cui, 2000, International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458).

Development of Next Generation Stretchable Materials for Flexible Hybrid Electronics (FHE)

M. Poliks, B. Chan, M. Alhendi, 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

225 Gb/s bi-directional integrated optical PCB link

C. L. Schow, J. A. Kash, F. E. Doany, 2011, 2011 Optical Fiber Communication Conference and Exposition and the National Fiber Optic Engineers Conference.

Organic optical waveguide fabrication in a manufacturing environment

B. Chan, How T. Lin, C. Carver, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).