J.H. Wu

A high aspect-ratio silicon substrate-via technology and applications: through-wafer interconnects for power and ground and Faraday cages for SOC isolation

K. Jenkins, J. D. del Alamo, J.H. Wu, 2000, International Electron Devices Meeting 2000. Technical Digest. IEDM (Cat. No.00CH37138).

A through-wafer interconnect in silicon for RFICs

J. Scholvin, J.A. del Alamo, J.H. Wu, 2004, IEEE Transactions on Electron Devices.