O. Slattery

Evaluation of Packaging Effect on MEMS Performance: Simulation and Experimental Study

C. O’Mahony, H. Walter, Maryna Lishchynska, 2007, IEEE Transactions on Advanced Packaging.

Performance and reliability of a three-dimensional plastic moulded vertical multichip module (MCM-V)

J. Barrett, C. Val, F. Waldron, 1995, 1995 Proceedings. 45th Electronic Components and Technology Conference.

Direct Comparison between Five Different Microchannels, Part 1: Channel Manufacture and Measurement

Mark Davies, Cian O'Mathuna, Cormac Eason, 2005 .

Methods of analysing thermomechanical stress in plastic packages for integrated circuits

C. Lyden, John Barrett, G. Kelly, 1995 .

Thermal and Mechanical Problems in Microelectronics

James C. Greer, G. Kelly, O. F. Slattery, 2000 .

Spring Constant Models for Analysis and Design of MEMS Plates on Straight or Meander Tethers

Conor O'Mahony, Maryna Lishchynska, Nicolas Cordero, 2006 .

Comprehensive spring constant modelling of tethered micromechanical plates

Conor O'Mahony, Maryna Lishchynska, Orla Slattery, 2006, Journal of Micromechanics and Microengineering.

Extensive electrical and thermal characterization of an MCM-D technology

E. Cabruja, J. Santander, M. Ullán, 2002 .

Modelling effects of packaging on pull-in behaviour of doubly-anchored beams

C. O’Mahony, Maryna Lishchynska, O. Slattery, 2006, EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.

Modelling electrostatic behaviour of microcantilevers incorporating residual stress gradient and non-ideal anchors

Conor O'Mahony, Maryna Lishchynska, Nicolas Cordero, 2005 .