C. Ko
发表
Kuan-Neng Chen,
Cheng-Hao Chiang,
L. Kuo,
2013,
IEEE Electron Device Letters.
Wen-Wei Shen,
Hsiang-Hung Chang,
W. Lo,
2015,
2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC).
Hsiang-Hung Chang,
W. Lo,
Kuan-Neng Chen,
2014,
IEEE Transactions on Device and Materials Reliability.
C. Ko,
J. Lau,
Po-Chun Huang,
2021,
Journal of Microelectronics and Electronic Packaging.
N. Lee,
J. Lau,
C. Ko,
2017
.
N. Lee,
J. Lau,
C. Ko,
2017,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
John H. Lau,
Ming Li,
Cao Xi,
2017
.
J. Lau,
J. Lo,
C. Ko,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Cheng-Ta Ko,
Li-Cheng Shen,
Chien-Wei Chien,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
Cheng-Ta Ko,
Yu-Hua Chen,
Tzu-Ying Kuo,
2006,
56th Electronic Components and Technology Conference 2006.
K. N. Chen,
C. Ko,
C. A. Cheng,
2011,
The 4th IEEE International NanoElectronics Conference.
N. Lee,
J. Lau,
J. Lo,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
T. Kuo,
D. Manessis,
A. Ostmann,
2008,
2008 2nd Electronics System-Integration Technology Conference.
Tao-Chih Chang,
C. Ko,
Li-Cheng Shen,
2007,
2007 International Microsystems, Packaging, Assembly and Circuits Technology.
J. Lau,
J. Lo,
C. Ko,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
C. Ko,
P. Lin,
Yu-Hua Chen,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
C. Ko,
R. Beica,
J. Lau,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
N. Lee,
J. Lau,
J. Lo,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
J. Lau,
C. Ko,
R. Beica,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Chia-Hsin Lee,
Ding-Ming Kwai,
Ming-Jer Kao,
2015,
2015 International Symposium on VLSI Technology, Systems and Applications.
C. K. Lee,
Y. J. Huang,
Y. H. Chen,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
Cheng-Ta Ko,
Kuan-Neng Chen,
Kuan-Neng Chen,
2010,
Microelectron. Reliab..
Kuan-Neng Chen,
Cheng-Ta Ko,
Kuan-Neng Chen,
2012,
Microelectron. Reliab..
Kuan-Neng Chen,
Cheng-Ta Ko,
Kuan-Neng Chen,
2013,
Microelectron. Reliab..
C. Ko,
P. Lin,
Yu-Hua Chen,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
John H. Lau,
Puru Bruce Lin,
Cheng-Ta Ko,
2021,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
J. Lau,
C. Ko,
Kai-Ming Yang,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
J. Lau,
J. Lo,
C. Ko,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
C. Ko,
J. Lau,
Kai-Ming Yang,
2021,
Journal of Microelectronics and Electronic Packaging.
C. Ko,
J. Lau,
Kai-Ming Yang,
2020
.
J. Lau,
C. Ko,
Kai-Ming Yang,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
John H. Lau,
Puru Bruce Lin,
Cheng-Ta Ko,
2020,
International Symposium on Microelectronics.
J. Lau,
C. Ko,
Kai-Ming Yang,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
J. Lau,
C. Ko,
Po-Chun Huang,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Keng C. Chou,
Kuan-Neng Chen,
Cheng-Ta Ko,
2014,
IEEE Transactions on Device and Materials Reliability.
C. Ko,
Yin-Po Hung,
Kai-Ming Yang,
2016,
2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Yu-Sheng Hsieh,
Kuan-Neng Chen,
Yao-Jen Chang,
2015,
IEEE Transactions on Device and Materials Reliability.
C. Ko,
J. Lau,
Kai-Ming Yang,
2022,
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Kuan-Neng Chen,
Yu-Wei Chang,
C. Ko,
2017,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
C. Ko,
J. Lau,
Kai-Ming Yang,
2022,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
C. Ko,
J. Lau,
P. Lin,
2021,
CPMT Symposium Japan.
J. Lau,
J. Lo,
C. Ko,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Yu-Min Lin,
Tao-Chih Chang,
Kuan-Neng Chen,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
A Novel Warpage Reinforcement Architecture with RDL Interposer for Heterogeneous Integrated Packages
Chi-Wei Wang,
Chang-Chun Lee,
Puru Bruce Lin,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
C. Ko,
K N Chen,
C A Cheng,
2011,
Journal of nanoscience and nanotechnology.
N. Lee,
J. Lau,
J. Lo,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
W. C. Lo,
Y. H. Chen,
K. N. Chen,
2012,
Proceedings of Technical Program of 2012 VLSI Technology, System and Application.
Shyh-Shyuan Sheu,
Kuan-Neng Chen,
Yao-Jen Chang,
2012,
IEEE Transactions on Device and Materials Reliability.
N. Lee,
Lin Jin,
J. Lo,
2018,
International Symposium on Microelectronics.
John H. Lau,
Ming Li,
Cao Xi,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Pei-Chen Huang,
Chang-Chun Lee,
Yan-Yu Liou,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Kuan-Neng Chen,
Yu-Wei Liu,
Han-Wen Hu,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Kuo-Shu Kao,
J. H. Lau,
Chau-Jie Zhan,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
J. H. Lau,
M. Brillhart,
Li Li,
2011
.
Wei-Chung Lo,
Yu-Hua Chen,
Peng-Shu Chen,
2012,
2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.
Kuan-Neng Chen,
Yao-Jen Chang,
Cheng-Ta Ko,
2013,
IEEE Electron Device Letters.