Xiaoxian Liu
发表
Yintang Yang,
Zhangming Zhu,
Chenguang Liao,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Yintang Yang,
Yuejin Li,
Zhangming Zhu,
2016
.
Yang Liu,
Zhangming Zhu,
Qijun Lu,
2019,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Yintang Yang,
Zhangming Zhu,
Xiaoxian Liu,
2015,
IEEE Microwave and Wireless Components Letters.
Yintang Yang,
Yang Liu,
Zhangming Zhu,
2017,
2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).
Yintang Yang,
Yang Liu,
Zhangming Zhu,
2020,
2020 International Conference on Microwave and Millimeter Wave Technology (ICMMT).
Yintang Yang,
Yang Liu,
Zhangming Zhu,
2018,
International Journal of RF and Microwave Computer-Aided Engineering.
Yintang Yang,
Yang Liu,
Zhangming Zhu,
2017,
2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).
Yintang Yang,
Zhangming Zhu,
Ruixue Ding,
2014,
IEICE Electron. Express.
Yintang Yang,
Zhangming Zhu,
Yang Liu,
2019,
IEEE Transactions on Microwave Theory and Techniques.
Yintang Yang,
Yang Liu,
Zhangming Zhu,
2021,
IEEE Transactions on Microwave Theory and Techniques.
Shengwen Zhong,
Nengwen Ding,
Xiaoxian Liu,
2022,
Electrochimica Acta.
Jun Luo,
Zhangming Zhu,
Yue Hao,
2013,
IEICE Electron. Express.
Jun Luo,
Zhangming Zhu,
Yue Hao,
2013,
IEICE Electron. Express.
Fengjuan Wang,
Yintang Yang,
Zhangming Zhu,
2013,
IEICE Electron. Express.
Xiaoxian Liu,
Xiaoxian Liu,
Xu Qin,
2013,
Biosensors & bioelectronics.
Yintang Yang,
Zhangming Zhu,
Ruixue Ding,
2017,
IEEE Microwave and Wireless Components Letters.
Liang Wu,
Xiaoxian Liu,
Jiye Liu,
2022,
IEEE Microwave and Wireless Components Letters.
Shuiyuan Wang,
Xiaoxian Liu,
P. Zhou,
2021,
Advanced materials.
Yintang Yang,
Zhangming Zhu,
Ruixue Ding,
2015
.
Fengjuan Wang,
Yintang Yang,
Ruixue Ding,
2013,
IEICE Electron. Express.
Zhangming Zhu,
Yang Liu,
Qijun Lu,
2018,
IEEE Transactions on Electromagnetic Compatibility.
Fengjuan Wang,
Yintang Yang,
Yan Zhang,
2013,
2013 14th International Conference on Electronic Packaging Technology.
Yintang Yang,
Yang Liu,
Xiaoxian Liu,
2022,
IEEE Transactions on Components, Packaging, and Manufacturing Technology.
Yintang Yang,
Xiaoxian Liu,
Zhangming Zhu,
2023,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Yang Liu,
Zhangming Zhu,
Yintang Yang,
2019,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Yintang Yang,
Yang Liu,
Xiaoxian Liu,
2022,
IEEE Transactions on Components, Packaging, and Manufacturing Technology.
Zhangming Zhu,
Yunfei En,
Chenbing Qu,
2021,
IEEE Transactions on Very Large Scale Integration (VLSI) Systems.
Xiaoxian Liu,
Xiaoxian Liu,
2014
.
Hao Wang,
Xiaoxian Liu,
Haoyu Zhuang,
2020,
IEEE Transactions on Very Large Scale Integration (VLSI) Systems.
Yintang Yang,
Fengjuan Wang,
Yang Liu,
2021,
IEEE Microwave and Wireless Components Letters.
Xiaoxian Liu,
Haoyu Zhuang,
He Tang,
2020,
IEEE Transactions on Circuits and Systems II: Express Briefs.
Yintang Yang,
Zhangming Zhu,
Ruixue Ding,
2016,
IEEE Microwave and Wireless Components Letters.
Yintang Yang,
Zhangming Zhu,
Ruixue Ding,
2015,
IEEE Microwave and Wireless Components Letters.
Yang Liu,
Yintang Yang,
Xiaoxian Liu,
2022,
IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications.
Yang Liu,
Qijun Lu,
Xiaoxian Liu,
2023,
IEEE Transactions on Circuits and Systems - II - Express Briefs.
Yintang Yang,
Zhangming Zhu,
Xiaoxian Liu,
2022,
Microelectron. J..
Zhangming Zhu,
Ruixue Ding,
Xiaoxian Liu,
2017,
IEEE Transactions on Electromagnetic Compatibility.