Xiaoyang Liu

for high performance processer

Daquan Yu, Haiyan Liu, Feng Jiang, 2015 .

Development of new TSV structure composing of intermetallic compounds

X. Jing, L. Wan, Yu Sun, 2012, 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).

Low thermal resistance design for a 2.5D package

Daquan Yu, Xiaoyang Liu, He Ma, 2013, 2013 14th International Conference on Electronic Packaging Technology.

Computational and Experimental Study of Different Brines in Temperature Swing Solvent Extraction Desalination with Amine Solvents

Ngai Yin Yip, Xiaoyang Liu, Elizabeth Dach, 2022, SSRN Electronic Journal.