T. Ohmi

Band structure calculation of strained graphene on hexagonal boron nitride

Y. Kamakura, T. Ohmi, 2012, 2012 IEEE International Meeting for Future of Electron Devices, Kansai.

Excellent electro/stress-migration-resistance surface-silicide passivated giant-grain Cu-Mg alloy interconnect technology for giga scale integration (GSI)

Tadahiro Ohmi, T. Takewaki, Takahisa Nitta, 1995, Proceedings of International Electron Devices Meeting.

ADVANCED COPPER METALLIZATION TECHNOLOGY FOR ULSI INTERCONNECTS

T. Ohmi, K. Tsubouchi, T. Ohmi, 1992 .