S. Mardani

发表

Copper and Silver Metallization for High Temperature Applications

S. Mardani, 2016 .

Influence of tantalum/tantalum nitride barriers and caps on the high-temperature properties of copper metallization for wide-band gap applications

Shi-Li Zhang, J. Olsson, S. Mardani, 2015 .

Impact of wavelength of UV light and UV cure time on chemical and mechanical properties of PECVD deposited porous ultra low-k films

K. Vanstreels, P. Verdonck, S. Mardani, 2013 .

Electrical properties of Ag/Ta and Ag/TaN thin-films

J. Olsson, D. Primetzhofer, S. Mardani, 2014 .

Bipolar integrated circuits in SiC for extreme environment operation

L. Lanni, A. Hallén, C. Zetterling, 2017 .

Morphological instability of Ag films caused by phase transition in the underlying Ta barrier layer

Shi-Li Zhang, J. Olsson, J. Wätjen, 2014 .

High-temperature Ta diffusion in the grain boundary of thin Cu films

Shi-Li Zhang, S. Mardani, U. Smith, 2016 .

Electromigration behavior of Cu metallization interfacing with Ta versus TaN at high temperatures

Shi-Li Zhang, J. Olsson, F. Gustavsson, 2016 .

Massive Ta diffusion observed in Cu thin films but not in Ag counterparts

Shi-Li Zhang, Dongping Wu, F. Gustavsson, 2016 .