K.-C Liang

Realize multiple hermetic chamber pressures for system-on-chip process by using the capping wafer with diverse cavity depths

W. Fang, Shyh-Wei Cheng, Jui-Chun Weng, 2018 .

Implementation of various vacuum conditions in sealed chambers for wafer-level bonding by using embedded cavity

W. Fang, Chia-Hua Chu, K.-C Liang, 2017 .

Design and implementation of monolithically integrated sealed and unsealed chambers by using the wafer level packaging

W. Fang, K.-C Liang, 2019, Journal of Micromechanics and Microengineering.

Bulk-Si with poly bump process scheme for MEMS sensors

D. Horsley, W. Fang, H. Tuan, 2012, 2012 IEEE Sensors.

Single chip process for sensors implementation, integration, and condition monitoring

D. Horsley, Chia-Hua Chu, K.-C Liang, 2013, 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII).

Monolithic CMOS—MEMS Pure Oxide Tri-Axis Accelerometers for Temperature Stabilization and Performance Enhancement

Weileun Fang, Yu-Chia Liu, Ming-Han Tsai, 2015, Journal of Microelectromechanical Systems.

Acceleration-insensitive fully-decoupled tuning fork (FDTF) MEMS vibratory gyroscope with 1°/HR BIAS instability

Weileun Fang, Sheng-Shian Li, Emerson Cheng, 2016, 2016 IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS).

A CMOS MEMS Pirani vacuum gauge with complementary bump heat sink and cavity heater

Weileun Fang, Chao-Lin Cheng, W. Fang, 2014, 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS).

On the design of piezoelectric MEMS scanning mirror for large reflection area and wide scan angle

W. Fang, K.-C Liang, Mingching Wu, 2022, Sensors and Actuators A: Physical.