B. Stark

A low-temperature thin-film electroplated metal vacuum package

K. Najafi, B. Stark, 2004, Journal of Microelectromechanical Systems.

MEMS Reliability Assurance Guidelines for Space Applications

B. Stark, 1999 .

A passive humidity monitoring system for in-situ remote wireless testing of micropackages

K. Najafi, M. Dokmeci, B. Stark, 2000, Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308).

Improving corrosion-resistance of polysilicon using boron doping and self-induced galvanic bias

K. Najafi, M. Dokmeci, B. Stark, 2003 .

A mold and transfer technique for lead-free fluxless soldering and application to MEMS packaging

K. Najafi, B. Stark, 2006, Journal of Microelectromechanical Systems.

A passive wireless integrated humidity sensor

K. Najafi, K. Najafi, B. Stark, 2001, Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090).

Mems inertial power generators for biomedical applications

Bernard H. Stark, Timothy C. Green, Eric M. Yeatman, 2006 .

Improving corrosion-resistance of silicon-glass micropackages using boron doping and/or self-induced galvanic bias

M. Dokmeci, B. Stark, T. Harpster, 2001, 2001 IEEE International Reliability Physics Symposium Proceedings. 39th Annual (Cat. No.00CH37167).

MEMS Reliability Assurance Activities at JPL

S. Kayali, S. Kayali, B. Stark, 2000 .

The fabrication of all-diamond packaging panels with built-in interconnects for wireless integrated microsystems

K. Najafi, K. Najafi, D. Aslam, 2004, Journal of microelectromechanical systems.

All diamond packaging for wireless integrated micro-systems using ultra-fast diamond growth

S. Guillaudeu, Xiangwei Zhu, D. Aslam, 2003, The Sixteenth Annual International Conference on Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE.

An Ultra-Thin Hermetic Package Utilizing Electroplated Gold

Khalil Najafi, B. H. Stark, K. Najafi, 2001 .