H. Takagi
发表
T. Suga,
R. Maeda,
H. Takagi,
1998
.
Y. Kurashima,
H. Takagi,
A. Maeda,
2015
.
Y. Kurashima,
H. Takagi,
A. Maeda,
2013
.
Naoya Watanabe,
Kay Yakushiji,
Jun Liu,
2020
.
Ryutaro Maeda,
Tadatomo Suga,
Hideki Takagi,
2003
.
Ryutaro Maeda,
Hideki Takagi,
R. Maeda,
2006
.
S. Yuasa,
A. Fukushima,
H. Kubota,
2017
.
Jian Lu,
R. Maeda,
Y. Nakano,
2013,
IEEE Sensors Journal.
Hideki Takagi,
Mitsunori Kokubo,
Ryuichiro Kamimura,
2017
.
Yoshiaki Nakano,
Mitsuru Takenaka,
Shinichi Takagi,
2009
.
T. Suga,
R. Maeda,
H. Takagi,
1999
.
C. Otani,
T. Taino,
H. Takagi,
2017
.
Hideki Takagi,
Yuichi Kurashima,
Y. Kurashima,
2017,
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
H. Takagi,
2005
.
R. Maeda,
H. Takagi,
2005
.
T. Suga,
R. Maeda,
H. Takagi,
2001,
Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090).
Ryutaro Maeda,
Tadatomo Suga,
Hideki Takagi,
2001
.
H. Takagi,
2022,
3D and Circuit Integration of MEMS.
T. Itoh,
T. Suga,
E. Higurashi,
2019,
Micromachines.
T. Itoh,
T. Suga,
E. Higurashi,
2019,
2019 International Conference on Electronics Packaging (ICEP).
Jian Lu,
Ryutaro Maeda,
Hideki Takagi,
2014
.
T. Itoh,
T. Suga,
E. Higurashi,
2019,
Japanese Journal of Applied Physics.
Hideki Takagi,
Jian Lu,
Yuichi Kurashima,
2014
.
Y. Kurashima,
H. Takagi,
T. Matsumae,
2018
.
Y. Kurashima,
H. Takagi,
A. Maeda,
2015,
2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC).
Y. Kurashima,
K. Harasaka,
H. Takagi,
2019,
Japanese Journal of Applied Physics.
Y. Kurashima,
H. Takagi,
T. Matsumae,
2018,
Microelectronic Engineering.
Y. Kurashima,
H. Umezawa,
Y. Mokuno,
2018,
Microelectronic Engineering.
H. Takagi,
N. Hatta,
T. Sakata,
2017
.
Y. Kurashima,
H. Takagi,
A. Maeda,
2013
.
Y. Kurashima,
H. Umezawa,
H. Takagi,
2019,
Japanese Journal of Applied Physics.
R. Maeda,
Jian Lu,
H. Takagi,
2013
.
Room-Temperature Wafer Bonding with Titanium Thin Films Based on Formation of Ti/Si Amorphous Layers
T. Suga,
E. Higurashi,
Y. Kurashima,
2019,
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
Tadatomo Suga,
Toshihiro Itoh,
Eiji Higurashi,
2019,
Int. J. Autom. Technol..
E. Higurashi,
Y. Kurashima,
H. Takagi,
2019,
ECS Journal of Solid State Science and Technology.
T. Irisawa,
H. Ota,
Y. Kurashima,
2017,
IEEE Transactions on Electron Devices.
T. Itoh,
T. Suga,
S. Takamatsu,
2020,
Micromachines.
R. Maeda,
Jian Lu,
H. Takagi,
2012,
2012 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS.
R. Maeda,
Jian Lu,
H. Takagi,
2012
.
R. Maeda,
Jian Lu,
H. Takagi,
2011,
2011 IEEE SENSORS Proceedings.
R. Maeda,
S. Youn,
H. Takagi,
2013
.
T. Suga,
E. Higurashi,
M. Hayase,
2021
.
E. Higurashi,
Y. Kurashima,
H. Takagi,
2021,
2021 International Conference on Electronics Packaging (ICEP).
E. Higurashi,
Y. Kurashima,
H. Takagi,
2020
.
E. Higurashi,
Y. Kurashima,
H. Takagi,
2019,
Microelectronic Engineering.
T. Itoh,
T. Suga,
E. Higurashi,
2019,
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
E. Higurashi,
H. Takagi,
T. Matsumae,
2018,
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).
Y. Kurashima,
H. Takagi,
A. Maeda,
2015
.
Room temperature wafer scale bonding of electroplated Au patterns processed by surface planarization
Y. Kurashima,
H. Takagi,
A. Maeda,
2014,
2014 International Conference on Electronics Packaging (ICEP).
R. Maeda,
S. Takamatsu,
H. Takagi,
2013
.
Hydrophilic Low-Temperature Direct Bonding of Diamond and Si Substrates Under Atmospheric Conditions
Y. Kurashima,
H. Umezawa,
H. Takagi,
2019,
Scripta Materialia.
T. Suga,
R. Maeda,
H. Takagi,
1997,
Proceedings of International Solid State Sensors and Actuators Conference (Transducers '97).
S. Yuasa,
A. Fukushima,
N. Watanabe,
2020,
Acta Materialia.
H. Mekaru,
H. Takagi,
A. Ohtomo,
2013
.
T. Itoh,
T. Suga,
E. Higurashi,
2019,
International Conference on Optical MEMS and Nanophotonics.
T. Suga,
R. Maeda,
H. Takagi,
1999
.
R. Maeda,
Masaharu Takahashi,
H. Takagi,
2008
.
M. Takenaka,
S. Takagi,
Y. Nakano,
2010,
2010 22nd International Conference on Indium Phosphide and Related Materials (IPRM).
Y. Kurashima,
H. Umezawa,
H. Takagi,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Y. Kurashima,
H. Umezawa,
H. Takagi,
2019
.
R. Maeda,
Jian Lu,
H. Takagi,
2013,
Microsystem Technologies.
Hideki Takagi,
Yuichi Kurashima,
Y. Kurashima,
2014
.
T. Ikawa,
H. Takagi,
M. Tsuchimori,
2002
.
Y. Hirai,
R. Maeda,
Masaharu Takahashi,
2007,
2007 Digest of papers Microprocesses and Nanotechnology.
H. Watanabe,
Koji Tanaka,
Y. Kurashima,
2020
.
H. Okada,
T. Itoh,
R. Maeda,
2003,
TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664).
Y. Hirai,
R. Maeda,
T. Iwasaki,
2008
.
Ryutaro Maeda,
Yasuroh Iriye,
Takuya Iwasaki,
2008
.
T. Irisawa,
V. Poborchii,
T. Maeda,
2016
.
R. Maeda,
S. Youn,
Masaharu Takahashi,
2009
.
E. Higurashi,
Y. Kurashima,
H. Takagi,
2019,
2019 International Conference on Electronics Packaging (ICEP).
E. Higurashi,
M. Hayase,
Y. Kurashima,
2020
.
S. Youn,
H. Takagi,
H. Hiroshima,
2015
.
Le Hac-Huong Thu,
E. Higurashi,
M. Hayase,
2022,
Sensors.
E. Higurashi,
M. Hayase,
Y. Kurashima,
2022,
Microsystems & Nanoengineering.
Le Hac-Huong Thu,
E. Higurashi,
Y. Kurashima,
2021,
2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
E. Higurashi,
Y. Kurashima,
H. Takagi,
2021
.
T. Itoh,
T. Suga,
E. Higurashi,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
J. Shiomi,
S. Maruyama,
I. Yamada,
2010,
2010 IEEE Sensors.
S. Matsumoto,
E. Higurashi,
Jian Lu,
2022,
Micromachines.
M. Takenaka,
S. Takagi,
M. Yokoyama,
2010
.
M. Takenaka,
S. Takagi,
Y. Nakano,
2010
.
K. Hatanaka,
H. Takagi,
Masashi Katsuyama,
2003
.
T. Itoh,
R. Maeda,
H. Takagi,
2014
.
T. Yasuda,
O. Ichikawa,
M. Hata,
2013
.
J. Shiomi,
S. Maruyama,
I. Yamada,
2010
.
Tadatomo Suga,
Hideki Takagi,
Naoe Hosoda,
1998
.
E. Higurashi,
Y. Kurashima,
H. Umezawa,
2021,
Journal of Applied Physics.
S. Youn,
H. Takagi,
H. Hiroshima,
2019,
Journal of Mechanical Science and Technology.
S. Takagi,
M. Takenaka,
M. Yokoyama,
2010,
2010 International Electron Devices Meeting.
Lulu Zhang,
Ryutaro Maeda,
Jian Lu,
2013,
The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems.
R. Maeda,
Lan Zhang,
H. Takagi,
2013
.
Y. Omura,
H. Funabashi,
H. Takagi,
2018
.
E. Higurashi,
Y. Kurashima,
H. Takagi,
2021,
Scientific Reports.
Tadatomo Suga,
H. Takagi,
Yutaka Takahashi,
1992
.
M. Takenaka,
S. Takagi,
M. Yokoyama,
2009
.
M. Hayase,
Y. Kurashima,
H. Takagi,
2023,
2023 International Conference on Electronics Packaging (ICEP).
Lulu Zhang,
Ryutaro Maeda,
Toshihiro Itoh,
2013,
The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems.
Ryutaro Maeda,
Hideki Takagi,
Jian Lu,
2014
.
Jian Lu,
Ryutaro Maeda,
Hideki Takagi,
2016
.
R. Maeda,
Jian Lu,
Lan Zhang,
2014
.
Jian Lu,
Ryutaro Maeda,
Hideki Takagi,
2013
.
R. Maeda,
Masaharu Takahashi,
H. Takagi,
2008
.
Ryutaro Maeda,
Tadatomo Suga,
Hideki Takagi,
1998
.
T. Suga,
K. Miyazawa,
H. Takagi,
1990
.
R. Maeda,
Yi Zhang,
M. Hayase,
2014
.
H. Mekaru,
H. Takagi,
A. Ohtomo,
2012,
Microsystem Technologies.
M. Kokubo,
H. Mekaru,
H. Takagi,
2011
.
T. Itoh,
Yi Zhang,
M. Hayase,
2012
.
E. Higurashi,
Y. Kurashima,
H. Umezawa,
2020,
Scripta Materialia.
N. Taoka,
M. Takenaka,
S. Takagi,
2011,
IEEE Electron Device Letters.
H. Akinaga,
I. Inoue,
H. Shima,
2007
.
E. Higurashi,
Y. Kurashima,
Kunihiko Nishimura,
2022,
SSRN Electronic Journal.
E. Higurashi,
H. Watanabe,
Koji Tanaka,
2020,
ECS Meeting Abstracts.
M. Hayase,
Y. Kurashima,
H. Takagi,
2023,
ACS Applied Nano Materials.
Jian Lu,
Ryutaro Maeda,
Hideki Takagi,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
Hideki Takagi,
Yuichi Kurashima,
Y. Kurashima,
2014
.