J. Frömel

Wafer level encapsulation of microsystems using glass frit bonding

M. Wiemer, R. Knechtel, J. Frömel, 2006 .

Wafer-level hermetic thermo-compression bonding using electroplated gold sealing frame planarized by fly-cutting

Muhammad Salman Al Farisi, Shuji Tanaka, Muhammad Salman Al Farisi, 2016 .

Technological Platform for Vertical Multi-Wafer Integration of Microscanners and Micro-Optical Components

C. Gorecki, M. Baranski, J. Frömel, 2019, Micromachines.

A novel approach for increasing the strength of an Au/Si eutectic bonded interface on an oxidized silicon surface

M. Esashi, M. Wiemer, T. Gessner, 2012 .

Vertical Integration Technologies for Optical Transmissive 3-D Microscanner based on Glass Microlenses☆

Sylwester Bargiel, Christophe Gorecki, Maciej Baranski, 2012 .

Bonding and contacting of MEMS-structures on wafer level

T. Gessner, J. Frömel, M. Wiemer, 2003 .

Micro-optical design of a three-dimensional microlens scanner for vertically integrated micro-opto-electro-mechanical systems.

Sylwester Bargiel, Christophe Gorecki, Maciej Baranski, 2015, Applied optics.

Technological platform for vertical multi-wafer integration of miniature imaging instruments

N. Passilly, C. Gorecki, M. Wiemer, 2015, Photonics West - Optoelectronic Materials and Devices.

Silicon wafer bonding for encapsulating surface-micromechanical-systems using intermediate glass layers

M. Wiemer, R. Knechtel, J. Frömel, 2003 .