N. Malik

Al-Al thermocompression bonding for wafer-level MEMS packaging

K. Schjølberg-Henriksen, T. Finstad, N. Malik, 2013, 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII).

Characterization of interfacial morphology of low temperature, low pressure Au–Au thermocompression bonding

K. Schjølberg-Henriksen, S. Iyer, M. Goorsky, 2018 .

Ultraviolet sensing properties of polyvinyl alcohol-coated aluminium-doped zinc oxide nanorods

Pramod Kumar, Arunandan Kumar, N. Malik, 2014, Bulletin of Materials Science.

Electrical, Mechanical, and Hermetic Properties of Low-Temperature, Plasma Activated Direct Silicon Bonded Joints

F. Fournel, K. Schjølberg-Henriksen, S. Moe, 2014 .

Texture of Al films for wafer-level thermocompression bonding

K. Schjølberg-Henriksen, T. Finstad, N. Malik, 2017 .

Interfacial characterization of Al-Al thermocompression bonds

T. Finstad, P. Carvalho, N. Malik, 2016 .

Impact of SiO2 on Al–Al thermocompression wafer bonding

K. Schjølberg-Henriksen, T. Finstad, N. Malik, 2015 .

Al-Al thermocompression bonding for wafer-level MEMS sealing

K. Schjølberg-Henriksen, T. Finstad, N. Malik, 2013 .