Tiwei Wei

发表

Q. Wang, Jian Cai, Tiwei Wei, 2014, 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).

E. Beyne, M. Baelmans, I. De Wolf, 2019, IEEE Transactions on Components, Packaging and Manufacturing Technology.

E. Beyne, M. Baelmans, I. De Wolf, 2019, IEEE Transactions on Power Electronics.

E. Beyne, M. Baelmans, I. De Wolf, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

M. Asheghi, Yujui Lin, Tiwei Wei, 2022, International Journal of Heat and Mass Transfer.

E. Beyne, M. Baelmans, V. Cherman, 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

E. Beyne, M. Baelmans, V. Cherman, 2020, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Qianying Wu, Tiwei Wei, Shuhang Lyu, 2023, 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

H. Mantooth, M. Asheghi, Yue Zhao, 2023, 2023 IEEE Applied Power Electronics Conference and Exposition (APEC).

Jeffery C. C. Lo, S. W. Ricky Lee, Xing Qiu, 2015, 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

H. Mantooth, M. Asheghi, Yujui Lin, 2022, 2022 IEEE Energy Conversion Congress and Exposition (ECCE).

E. Beyne, V. Cherman, H. Oprins, 2023, Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

E. Beyne, M. Baelmans, I. De Wolf, 2019, 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

E. Beyne, M. Baelmans, V. Cherman, 2021, IEEE Transactions on Components, Packaging and Manufacturing Technology.