D. Vogel

发表

Determination of Packaging Material Properties Utilizing Image Correlation Techniques

B. Michel, R. Kuhnert, M. Dost, 2002 .

Digital image correlation of nanoscale deformation fields for local stress measurement in thin films

Carles Cané, Bernd Michel, Dietmar Vogel, 2006 .

FibDAC - Residual Stress Determination by Combination of Focused Ion Beam Technique and Digital Image Correlation

B. Michel, J. Auersperg, N. Sabaté, 2006 .

Measurement of residual stresses in micromachined structures in a microregion

Carles Cané, Bernd Michel, N. Sabaté, 2006 .

Image Correlation Techniques for Microsystems Inspection

D. Vogel, B. Michel, 2019, Optical Inspection of Microsystems.

mTest-a new approach to measure material properties from microscopic specimens

B. Michel, R. Dudek, H. Walter, 2001, First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592).

Crack and damage evaluation in low-k BEoL stacks under assembly and CPI aspects

B. Michel, J. Auersperg, D. Vogel, 2010, 3rd Electronics System Integration Technology Conference ESTC.

Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

R. Dudek, S. Rzepka, D. Vogel, 2018 .

Crack and delamination risk evaluation of thin silicon applications based on fracture mechanics approaches

B. Michel, J. Auersperg, D. Vogel, 2004, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.

Thermo-mechanical characterization of copper through-silicon vias (Cu-TSVs) using micro-Raman spectroscopy and atomic force microscopy

B. Michel, S. Rzepka, D. Zahn, 2015 .

Crack and delamination Risk Evaluation in low-k BEol

B. Michel, J. Auersperg, D. Vogel, 2013 .

Crack and Damage Evaluation in low-k Interconnect Structuresunder Chip Package Interaction Aspects

B. Michel, J. Auersperg, D. Vogel, 2013, CP 2013.

Crack and damage evaluation in low-k BEoL structures under CPI aspects

B. Michel, J. Auersperg, D. Vogel, 2009, Electronic Packaging Technology Conference.

Crack and damage evaluation in low-k BEoL stacks under chip package interaction aspects

B. Michel, J. Auersperg, D. Vogel, 2009, EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

Stress measurements on TSVs and BEoL structures with high spatial resolution

S. Rzepka, E. Auerswald, D. Vogel, 2015, 2015 China Semiconductor Technology International Conference.

Quantitative Determination of the Mechanical Stresses in BEoL Films and Structures on Si Wafers with Sub-micron Spatial Resolution by fibDAC

B. Michel, S. Rzepka, E. Auerswald, 2012 .

Local stress measurement methods for packaging purposes- A comparison

B. Michel, D. Vogel, A. Gollhardt, 2010, 3rd Electronics System Integration Technology Conference ESTC.

fibDAC stress relief - A novel stress measurement approach with high spatial resolution

B. Michel, D. Vogel, I. Maus, 2010, 3rd Electronics System Integration Technology Conference ESTC.

Residual Stress Measurements of High Spatial Resolution

B. Michel, D. Vogel, F. Luczak, 2008 .

Mechanical failure in COB-technology using glob-top encapsulation

Bernd Michel, Rainer Dudek, Dietmar Vogel, 1996 .

3D deformation analysis of flow and gas sensors membranes for reliability assessment

Carles Cane, Joan Ramon Morante, Dietmar Vogel, 2005, SPIE Microtechnologies.

Measurement of residual stress by slot milling with focused ion-beam equipment

Carles Cané, Bernd Michel, Dietmar Vogel, 2006 .

High temperature degradation of Pt/Ti electrodes in micro-hotplate gas sensors

Carles Cané, Bernd Michel, Dietmar Vogel, 2003 .

Displacement and Strain Field Measurements from SPM Images

Bernd Michel, A. Schubert, Dietmar Vogel, 2004 .

Localized Stress Measurements - A New Approach Covering Needs for Advanced Micro and Nanoscale System Development

H. Reichl, B. Michel, N. Sabate, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Measurement of stresses in MEMS structures by stress release

Dietmar Vogel, Astrid Gollhardt, Neus Sabate, 2007, SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring.

Simulation of Deformation and Fracture Behaviour in Microelectronic Packaging

H. Walter, B. Michel, D. Vogel, 2006 .

4428 - A COMBINED SIMULATIVE AND EXPERIMENTAL APPROACH TO RELIABILITY OPTIMIZATION OF MEMS

Dietmar Vogel, Bernd Michel, O. Wittler, 2013 .

Design methodology of microstructures for enhanced mechanical reliability

Olaf Wittler, Dietmar Vogel, Juergen Keller, 2005, International Conference on Experimental Mechanics.

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

H. Reichl, B. Michel, J. Auersperg, 1997, Application of Fracture Mechanics in Electronic Packaging.

Reliability assessment and failure mode analysis of MEMS accelerometers for space applications

Markku Lahti, Vaclav Pejchal, Olha Sereda, 2018, Microelectron. Reliab..

MicroDAC strain measurement for electronics packaging structures

Bernd Michel, A. Schubert, Dietmar Vogel, 2001 .

Microscale deformation analysis

M. Dost, D. Vogel, J. Auersperg, 2020 .

Crack and damage in low-k BEoL stacks under assembly and CPI aspects

B. Michel, D. Vogel, J. Auersperg, 2010, 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).

Advanced Experimental and Simulation Approaches to Meet Reliability Challenges of New Electronics Systems

Bernd Michel, Dietmar Vogel, Jürgen Auersperg, 2009 .

Challenges for Multi-Scale Modeling of Multiple Failure Modes in Microelectronics Packaging

D. Vogel, B. Michel, J. Auersperg, 2008, 2008 10th Electronics Packaging Technology Conference.

Stress analyses of high spatial resolution on TSV and BEoL structures

Bernd Michel, Dietrich R. T. Zahn, Sven Rzepka, 2014, Microelectron. Reliab..

Local stress measurement on metal lines and dielectrics of BEoL pattern by stress relief technique

B. Michel, S. Rzepka, D. Vogel, 2011, 2011 Semiconductor Conference Dresden.

Thermal and mechanical analysis of micromachined gas sensors

Carles Cané, Bernd Michel, Dietmar Vogel, 2003 .

FIB-based technique for stress characterization on thin films for reliability purposes

C. Cané, N. Sabaté, B. Michel, 2007 .

FIB based measurements for material characterization on MEMS structures

Joan Ramon Morante, Dietmar Vogel, Astrid Gollhardt, 2005, SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring.

FIB-based measurement of local residual stresses on microsystems

Dietmar Vogel, Astrid Gollhardt, Bernd Michel, 2006, SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring.

Fast and trusted intrinsic stress measurement to facilitate improved reliability assessments

Sven Rzepka, Dietmar Vogel, Ellen Auerswald, 2016, Microelectron. Reliab..

Experimental analysis of mechanical stresses and material properties in multi-layer interconnect systems by fibDAC

B. Michel, S. Rzepka, E. Auerswald, 2013, 2013 IEEE International Interconnect Technology Conference - IITC.

Measuring techniques for deformation and stress analysis in micro-dimensions

B. Michel, S. Rzepka, E. Auerswald, 2013, 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

4772 - CRACK AND DELAMINATION RISK EVALUATION OF THIN SILICON BASED MICROELECTRONICS DEVICES

B. Michel, J. Auersperg, D. Vogel, 2013 .

Damage and fracture evaluation in microelectronic assemblies by FEA and experimental investigations

B. Michel, J. Auersperg, D. Vogel, 1998, 2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225).

Residual Stress Measurement on a MEMS Structure With High-Spatial Resolution

C. Cane, B. Michel, N. Sabate, 2007, Journal of Microelectromechanical Systems.