T. Sanders
发表
R. Bucci,
A. Thakker,
T. Sanders,
1980
.
John L. Evans,
M. Bozack,
F. Megahed,
2016,
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
G. L. Liedl,
T. Sanders,
K. Mahalingam,
1987
.
G. L. Liedl,
T. Sanders,
K. Mahalingam,
1986
.
T. Sanders,
Z. Hai,
Cong Zhao,
2016
.
J. Suhling,
M. Bozack,
T. Sanders,
2016
.
T. Sanders,
M. Dayananda,
S. Jha,
1987
.
John L. Evans,
T. Sanders,
Jiawei Zhang,
2020,
2020 Pan Pacific Microelectronics Symposium (Pan Pacific).
T. Sanders,
M. Marek,
J. Rinker,
1984
.
R. E. Frishmuth,
T. Sanders,
G. T. Embley,
1981
.
P. Niskanen,
T. Sanders,
M. Marek,
1982
.
P. Donnadieu,
T. Sanders,
G. Lapasset,
1994
.
Preet M. Singh,
T. Sanders,
M. Trexler,
2008
.
T. Sanders,
J. Staley,
D. Mauney,
1977
.
John L. Evans,
M. Bozack,
G. Flowers,
2016,
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
G. L. Liedl,
T. Sanders,
B. Gu,
1985
.
T. Sanders,
1979
.
T. Sanders,
S. Jha,
J. Sater,
1987
.
T. Sanders,
1983
.
T. Sanders,
J. Sater,
R. Garrett,
1986
.
Thermal Shock Reliability of Isothermally Aged Doped Lead-Free Solder With Semiparametric Estimation
John L. Evans,
Michael J. Bozack,
Wayne R. Johnson,
2019,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
John L. Evans,
G. Flowers,
T. Sanders,
2014,
Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
John L. Evans,
M. Bozack,
T. Sanders,
2015
.
T. Sanders,
R. Garrett,
1983
.
T. Sanders,
T. Khan,
M. Macia,
1996
.
T. Sanders,
Y. Riddle,
M. McIntosh,
2013
.