Jin Young Kim

A Cost-Effective MEMS Cavity Packaging Technology for Mass Production

Choonheung Lee, F. Faheem, J. Lee, 2009, IEEE Transactions on Advanced Packaging.

A Methodology for Drop Performance Modeling and Application for Design Optimization of Chip-Scale Packages

Seung Mo Kim, Wei Lin, Jin Young Kim, 2005, IEEE Transactions on Electronics Packaging Manufacturing.

Below 45nm low-k layer stress minimization guide for high-performance flip-chip packages with copper pillar bumping

Jin Young Kim, Choonheung Lee, M. W. Lee, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).