T. Suni

发表

Silicon-on-Insulator Wafers with Buried Cavities

J. Dekker, T. Suni, K. Henttinen, 2006 .

Nondestructive Characterization of Fusion and Plasma Activated Wafer Bonding Using Mesa and Recess Structures

J. Dekker, T. Suni, A. Varpula, 2015 .

Thick-Film SOI Wafers: Preparation and Properties

T. Suni, J. Mäkinen, 2010 .

Reliability of wafer-level SLID bonds for MEMS encapsulation

M. Paulasto-Krockel, V. Vuorinen, T. Suni, 2013, 2013 Eurpoean Microelectronics Packaging Conference (EMPC).

Bonded thick film SOI with pre-etched cavities

Hannu Luoto, James Dekker, T. Suni, 2006 .

Characterization of bonded interface by HF etching method

J. Kiihamaki, I. Suni, T. Suni, 2003 .

Low-temperature bonding of thick-film polysilicon for microelectromechanical system (MEMS)

H. Kattelus, T. Suni, K. Henttinen, 2006 .

Low-temperature Bonding of Thick-film Polysilicon for MEMS

H. Kattelus, T. Suni, K. Henttinen, 2004 .

Photocurrent method for characterizing the interface of hydrophobically bonded Si wafers

P. Yu, D. Qiao, S. Lau, 2003 .

Ion beam studies of hydrogen implanted Si wafers

A. Tolkki, I. Suni, T. Suni, 2004 .

Comparison of thermally and mechanically induced Si layer transfer in hydrogen-implanted Si wafers

M. Nastasi, S. Lau, W. Ensinger, 2004 .

Silicon direct bonding

T. Suni, K. Henttinen, 2020, Handbook of Silicon Based MEMS Materials and Technologies.

Wafer Scale Packaging of MEMS by Using Plasma-Activated Wafer Bonding

J. Dekker, T. Suni, K. Henttinen, 2006 .

Polishing of bulk micro-machined substrates by fixed abrasive pads for smoothing and planarization of MEMS structures

T. Suni, K. Henttinen, H. Luoto, 2005, IEEE/SEMI Conference and Workshop on Advanced Semiconductor Manufacturing 2005..

Chapter 29 – Silicon Direct Bonding

T. Suni, K. Henttinen, 2015 .

Effects of Plasma Activation on Hydrophilic Bonding of Si and SiO2

T. Suni, Jari Mäkinen, Ilkka Suni, 2002 .

Wafer-level SLID bonding for MEMS encapsulation

J. Li, T. Suni, H. Heikkinen, 2013 .

Analysis of microstructural evolution in SLID-bonding used for hermetic encapsulation of MEMS devices

T. Laurila, M. Paulasto-Krockel, V. Vuorinen, 2012, 2012 4th Electronic System-Integration Technology Conference.

Strain and electrical characterization of metal-oxide-semiconductor field-effect transistor fabricated on mechanically and thermally transferred silicon on insulator films

P. Yu, S. Lau, J. Bickford, 2004 .

Transfer of thin Si layers by cold and thermal ion cutting

Hannu Luoto, S. Karirinne, T. Suni, 2003 .

Silicon layer transfer using plasma hydrogenation

T. Alford, M. Nastasi, P. Chu, 2005 .

A Versatile Timing Microsystem Based on Wafer-Level Packaged XTAL/BAW Resonators With Sub-$\mu$ W RTC Mode and Programmable HF Clocks

Charles Alix Manier, Kai Zoschke, Hermann Oppermann, 2013, IEEE Journal of Solid-State Circuits.

A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µW RTC mode and programmable HF clocks

Charles Alix Manier, Kai Zoschke, Hermann Oppermann, 2013, 2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers.

Direct wafer bonding for MEMS and microelectronics

T. Suni, T. Suni, 2006 .

Characteristics of transistors fabricated on silicon-on-quartz prepared using a mechanically initiated exfoliation technique

I. Suni, T. Suni, K. Henttinen, 2005, IEEE Electron Device Letters.

Silicon full wafer bonding with atomic layer deposited titanium dioxide and aluminum oxide intermediate films

Hannu Kattelus, Hiroyuki Fujita, Alain Bosseboeuf, 2012 .

Reducing stiction in Microelectromechanical Systems by nanometer-scale films grown by atomic layer deposition

J. Kiihamaki, H. Kattelus, T. Suni, 2011, 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference.

Integration of CMP Fixed Abrasive Polishing into the Manufacturing of Thick Film SOI Substrates

T. Suni, K. Henttinen, H. Luoto, 2005 .

Thick-film silicon-on-insulator wafers preparation and properties

T. Suni, J. Mäkinen, 2020 .

Wafer level packaging of MEMS and 3D integration with CMOS for fabrication of timing microsystems

Klaus-Dieter Lang, Kai Zoschke, David Ruffieux, 2016, 2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP).

Wafer level packaging for hermetical encapsulation of MEMS resonators

K. Zoschke, H. Oppermann, J. Dekker, 2015, 2015 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP).

Vacuum packaging at wafer level for MEMS using gold-tin metallurgy

K. Zoschke, H. Oppermann, J. Dekker, 2013, 2013 Eurpoean Microelectronics Packaging Conference (EMPC).

Effects of Plasma Activation on Hydrophilic Bonding of Si and SiO2

I. Suni, T. Suni, K. Henttinen, 2002 .