Ehrenfried Zschech

发表

Devices, Materials, and Processes for Nanoelectronics: Characterization with Advanced X‐Ray Techniques Using Lab‐Based and Synchrotron Radiation Sources

Ehrenfried Zschech, Christophe Wyon, Conal E. Murray, 2011 .

Editorial for the Special Issue “Characterization of Nanomaterials: Selected Papers from 6th Dresden Nanoanalysis Symposium”

Robert Sinclair, Rodrigo Martins, Ehrenfried Zschech, 2019, Nanomaterials.

Characterization of layer stacks in microelectronic products : Challenges to sample preparation and TEM analysis

Ehrenfried Zschech, Hans-Jürgen Engelmann, Holger Saage, 2001 .

Managing stress-induced effects on performance and reliability of 3D IC stacks

Ehrenfried Zschech, 2014 .

Advanced methods for mechanical and structural characterization of nanoscale materials for 3D IC integration

Ehrenfried Zschech, Martin Gall, Christoph Sander, 2014, Microelectron. Reliab..

Multi‐Scale Environment For Simulation And Materials Characterization In Stress Management For 3D IC TSV‐Based Technologies—Effect Of Stress On The Device Characteristics

Valeriy Sukharev, Ehrenfried Zschech, 2011 .

Stress-induced phenomena in metallization : eighth International Workshop on Stress-Induced Phenomena in Metallization : Dresden, Germany, 12-14 September 2005

Ehrenfried Zschech, 2006 .

Deep Learning-based Inaccuracy Compensation in Reconstruction of High Resolution XCT Data

Markus Löffler, Ehrenfried Zschech, Emre Topal, 2020, Scientific Reports.

Forward to the Special Section on “Materials, Processing, and Reliability of 3-D Interconnects”

Larry Smith, Ehrenfried Zschech, Paul S. Ho, 2012 .

Analysis of electromigration-induced backflow stresses in Cu(Mn) interconnects using high statistical sampling

Ehrenfried Zschech, Martin Gall, Christoph Sander, 2018, 2018 IEEE International Reliability Physics Symposium (IRPS).

Foreword to the Special Section on “Stress-Induced Phenomena in Microelectronics”

Ehrenfried Zschech, Paul S. Ho, 2016 .

集束イオンビームフライス加工によるシリコン中のGa汚染:動的モデルシミュレーションと原子プローブトモグラフィー実験【Powered by NICT】

Ehrenfried Zschech, Jin Huang, M. Loeffler, 2016 .

Multi-scale radiographic applications in microelectronic industry

Norbert Meyendorf, Klaus-Jurgen Wolter, Markus Löffler, 2016 .

Advanced Concepts for TDDB Reliability in Conjunction with 3D Stress

Kong Boon Yeap, Ehrenfried Zschech, Martin Gall, 2014 .

Surface-sensitive strain analysis of Si/SiGe line structures by Raman and UV-Raman spectroscopy

Ehrenfried Zschech, Peter Hermann, Victor Vartanian, 2009, NanoScience + Engineering.

AIP Conference Proceedings: Preface

Ehrenfried Zschech, Hisao Kawasaki, Paul S. Ho, 2006 .

Analysis of 28 nm SRAM cell stability under mechanical load applied by nanoindentation

Ehrenfried Zschech, Martin Gall, Roland Jancke, 2018, 2018 IEEE International Reliability Physics Symposium (IRPS).

The launch of BMC Materials

Pedro Barquinha, Ehrenfried Zschech, Wenguo Cui, 2019, BMC Materials.

Stress-induced phenomena in metallization : Ninth international workshop on stress-induced phenomena in metallization, Kyoto, Japan 4 - 6 April 2007

Ehrenfried Zschech, Paul S. Ho, Shinichi Ogawa, 2007 .

Preface: Proceedings of the Twelfth European Workshop on Materials for Advanced Metallization 2008

Ehrenfried Zschech, Stefan Schulz, Heinrich Körner, 2008 .

Application of high-resolution X-ray microscopy to image backend-of- line structures

Stefan Braun, Ehrenfried Zschech, Wenbing Yun, 2008 .

Ga contamination in silicon by Focused Ion Beam milling: Dynamic model simulation and Atom Probe Tomography experiment

Jin Huang, Ehrenfried Zschech, M. Loeffler, 2016, Microelectron. Reliab..

Multi-scale Simulation Methodology for Stress Assessment in 3D IC: Effect of Die Stacking on Device Performance

Valeriy Sukharev, Jun-Ho Choy, Ara Markosian, 2012, J. Electron. Test..

Multi-scale X-ray tomography for process and quality control in 3D TSV packaging

Ehrenfried Zschech, Sven Niese, M. Jürgen Wolf, 2014 .

Thin Film and Interface Analysis of Microprocessor Device Structures – Requirements and Practical Examples

Werner Blum, H.-J. Engelmann, Ehrenfried Zschech, 2005 .

Prediction of SRAM Reliability Under Mechanical Stress Induced by Harsh En§ironments

Ehrenfried Zschech, Martin Gall, Roland Jancke, 2018, 2018 48th European Solid-State Device Research Conference (ESSDERC).

Strategy to Characterize Electromigration Short Length Effects in Cu/low-k Interconnects

Ehrenfried Zschech, Martin Gall, André Clausner, 2021, 2021 IEEE International Reliability Physics Symposium (IRPS).

A model for electromigration-induced degradation mechanisms in dual-inlaid copper interconnects: Effect of interface bonding strength

Valeriy Sukharev, Ehrenfried Zschech, V. Sukharev, 2004 .

Analytics and Metrology of Strained Silicon Structures by Raman and Nano‐Raman Spectroscopy

Ehrenfried Zschech, Michael Hecker, Holm Geisler, 2007 .

A model for electromigration-induced degradation mechanisms in dual-inlaid copper interconnects: Effect of microstructure

Valeriy Sukharev, Ehrenfried Zschech, William D. Nix, 2007 .

Full-field X-ray microscopy with crossed partial multilayer Laue lenses.

Christian G. Schroer, Andreas Leson, Stefan Braun, 2014, Optics express.

Electron Backscatter Diffraction: Application to Cu Interconnects in Top-View and Cross Section

Ehrenfried Zschech, E. Zschech, M. Meyer, 2005 .

Nano-Scale Analysis Using Synchrotron-Radiation: Applications in the Semiconductor Industry

Ehrenfried Zschech, Gerd Schneider, Ralph Spolenak, 2008 .

Direct evidence of electromigration failure mechanism in dual-damascene Cu interconnect tree structures

Ehrenfried Zschech, Ahila Krishnamoorthy, S. G. Mhaisalkar, 2005 .

Enabling Energy Efficiency and Polarity Control in Germanium Nanowire Transistors by Individually Gated Nanojunctions.

Thomas Mikolajick, Ehrenfried Zschech, Jens Trommer, 2017, ACS nano.

Structure and thermal stability of graded Ta-TaN diffusion barriers between Cu and SiO2

Klaus Wetzig, Ehrenfried Zschech, Johann W. Bartha, 2003 .

Dynamical x-ray microscopy investigation of electromigration in passivated inlaid Cu interconnect structures

Erik H. Anderson, Gregory Denbeaux, Ehrenfried Zschech, 2002 .

Microstructural characterization of inlaid copper interconnect lines

Ehrenfried Zschech, Larry Zhao, Stewart Rose, 2001 .

Applying x-ray microscopy and finite element modeling to identify the mechanism of stress-assisted void growth in through-silicon vias

Alain C. Diebold, Kong Boon Yeap, Ehrenfried Zschech, 2011 .

Materials for Information Technology

Ehrenfried Zschech, E. Zschech, 2010 .

Novel SThM nanoprobe for thermal properties investigation of micro- and nanoelectronic devices

Teodor Gotszalk, Dariusz Szmigiel, P. Grabiec, 2010 .

Advanced Interconnects for ULSI Technology

Ehrenfried Zschech, Paul S. Ho, Mikhail R. Baklanov, 2012 .

3D-interconnect: Visualization of extrusion and voids induced in copper-filled through-silicon vias (TSVs) at various temperatures using X-ray microscopy

Andrew C. Rudack, Alain C. Diebold, Ehrenfried Zschech, 2012 .

Effects of laser-induced heating on Raman stress measurements of silicon and silicon-germanium structures

Ehrenfried Zschech, Michael Hecker, M. Hecker, 2007 .

Stress-induced phenomena in nanosized copper interconnect structures studied by x-ray and electron microscopy

Oliver Aubel, Ehrenfried Zschech, Gerd Schneider, 2009 .

NanoXCT—A High‐Resolution Technique For TSV Characterization

Ehrenfried Zschech, Sven Niese, Peter Krueger, 2011 .

A Delamination Strategy for Thinly Layered Defect-Free High-Mobility Black Phosphorus Flakes.

Ehrenfried Zschech, Sheng Yang, Wojciech Pisula, 2018, Angewandte Chemie.

Microstructure, hardness profile and tensile strength in welds of AA6013 T6 extrusions

Ehrenfried Zschech, L. A. Guitterez, G. Neye, 1996 .

Nanoindentation for reliability assessment of ULK films and interconnects structures

Kong Boon Yeap, Ehrenfried Zschech, Holm Geisler, 2013 .

Texture and Stress Study of Sub-Micron Copper Interconnect Lines Using X-ray Microdiffraction

Ehrenfried Zschech, Holm Geisler, Inka Zienert, 2005 .

Direct evidence of Cu/cap/liner edge being the dominant electromigration path in dual damascene Cu interconnects

H.-J. Engelmann, Ehrenfried Zschech, Subodh G. Mhaisalkar, 2007 .

In situ study on low-k interconnect time-dependent-dielectric-breakdown mechanisms

Kong Boon Yeap, Patrick Justison, Oliver Aubel, 2014 .

Carrier Mobility Shift in Advanced Silicon Nodes Due to Chip Package Interaction

Wei Zhao, Riko Radojcic, Mark Nakamoto, 2017 .

Multi-scale X-ray tomography and machine learning algorithms to study MoNi4 electrocatalysts anchored on MoO2 cuboids aligned on Ni foam

Ehrenfried Zschech, Jian Zhang, Jürgen Gluch, 2020, BMC Materials.

Polymer Brushes on Hexagonal Boron Nitride.

Andreas Winter, Ehrenfried Zschech, Christof Neumann, 2019, Small.

Microstructure effect on EM-induced copper interconnect degradation: Experiment and simulation

Valeriy Sukharev, Ehrenfried Zschech, 2005 .

Physical failure analysis in semiconductor industry—challenges of the copper interconnect process

Ehrenfried Zschech, Kornelia Dittmar, Eckhard Langer, 2002 .

High-resolution X-ray imaging—a powerful nondestructive technique for applications in semiconductor industry

Ehrenfried Zschech, Gerd Schneider, Wenbing Yun, 2008 .

Characterization of Chemical Bonding in Low-K Dielectric Materials for Interconnect Isolation: A XAS and EELS Study

Ehrenfried Zschech, Franz J. Himpsel, Heiko Stegmann, 2006 .

Microfabricated resistive high-sensitivity nanoprobe for scanning thermal microscopy

Teodor Gotszalk, Piotr Grabiec, Dariusz Szmigiel, 2010 .

Electromigration void nucleation and growth analysis using large-scale early failure statistics

Kong Boon Yeap, Oliver Aubel, G. Talut, 2014 .

Nano-raman spectroscopy with metallized atomic force microscopy tips on strained silicon structures

Ehrenfried Zschech, Andreas Mai, Michael Hecker, 2007 .

In situ observation of electromigration-induced void migration in dual-damascene Cu interconnect structures

Ehrenfried Zschech, Ahila Krishnamoorthy, S. G. Mhaisalkar, 2004 .

Effect of mass transport along interfaces and grain boundaries on copper interconnect degradation

Ehrenfried Zschech, Eckhard Langer, E. Zschech, 2004 .

Calibration of atomic force microscope

Teodor Gotszalk, Ehrenfried Zschech, P. Zawierucha, 2008 .

Metrology and Failure Analysis for 3D IC Integration

Alain C. Diebold, Ehrenfried Zschech, E. Zschech, 2011 .

Effect of interface strength on electromigration-induced inlaid copper interconnect degradation: Experiment and simulation

Valeriy Sukharev, Ehrenfried Zschech, Ahila Krishnamoorthy, 2005, International Journal of Materials Research.