D. Peterson

发表

A comparison of the theory of moisture diffusion in plastic encapsulated microelectronics with moisture sensor chip and weight-gain measurements

M. Pecht, H. Ardebili, C. Hillman, 2002 .

High reliability plastic packaging for microelectronics

J. Sweet, D. Peterson, M. Tuck, 1997 .

SANDIA REPORT SAND 96-2801 UC-704 Unlimited Release Printed November 1996 3 D Packaging for Integrated Circuit Systems

D. Palmer, J. Sweet, D. Peterson, 2008 .

Design and Experimental Evaluation of a 3 rd Generation Addressable CMOS Piezoresistive Stress Sensing Test Chipl

J. Sweet, D. Peterson, 2000 .

Liquid encapsulant and uniaxial calibration mechanical stress measurement with the ATC04 assembly test chip

J. N. Sweet, D. W. Peterson, J. Sweet, 1994, 1994 Proceedings. 44th Electronic Components and Technology Conference.

High Accuracy Die Mechanical Stress Measurement with the ATC04 Assembly Test Chip

J. Sweet, D. Peterson, 1993, International Integrated Reliability Workshop Final Report.

A synthetic inflow generation method using the attached eddy hypothesis

I. Marusic, G. Candler, D. Peterson, 2006 .

Evaluation of chip passivation and coatings using special purpose assembly test chips and porous silicon moisture detectors

J. Sweet, D. Peterson, M. Tuck, 1991, 1991 Proceedings 41st Electronic Components & Technology Conference.

Diamond-a new high thermal conductivity substrate for multichip modules and hybrid circuits

D. Peterson, D. Norwood, W. Worobey, 1993, Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93).

Pneumatically modulated GCxGC development for handheld instrumentation for military and homeland security applications.

John R. Anderson, Joshua J. Whiting, Cody M. Washburn, 2008 .

Stresses from flip-chip assembly and underfill; measurements with the ATC4.1 assembly test chip and analysis by finite element method

J. Sweet, D. Peterson, S. Burchett, 1997, 1997 Proceedings 47th Electronic Components and Technology Conference.

POROUS SI STRUCTURE AS MOISTURE SENSORt

D. Peterson, L. Nguyen, 2008 .

The relative electric fields in a thin film on an opaque substrate

D. Peterson, J. A. Johnson, 1969 .

Ellipsometer Study of Anomalous Absorption in Very Thin Dielectric Films on Evaporated Metals

N. Bashara, D. Peterson, 1966 .

A proposed method for predicting the phase behavior of v.l.f. radio signals

D. Peterson, 1969 .

Bio micro fuel cell grand challenge final report.

Swapnil Chhabra, Blake A. Simmons, Stanley H. Kravitz, 2005 .

Timely multithreat biological, chemical and nuclide detection: a platform, a metric, key results

Paul C. Galambos, Conrad D. James, Kamyar Rahimian, 2008 .

MEMS Packaging - Current Issues and Approaches

David W. Peterson, Paul V. Dressendorfer, Cathleen A. Reber, 2000 .

Deep learning based characterization of nanoindentation induced acoustic events

D. Peterson, A. Daugela, C. Chang, 2021 .

IC chip stress during plastic package molding

J. Sweet, D. Peterson, D. Palmer, 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

Error in Dielectric-Film Ellipsometer Determinations due to Neglect of Film Absorption*

N. Bashara, D. Peterson, 1965 .

HAST evaluation of organic liquid IC encapsulants using Sandia's assembly test chips

J. N. Sweet, D. W. Peterson, J. Sweet, 1992, 1992 Proceedings 42nd Electronic Components & Technology Conference.