E. Langer

In situ SEM observation of electromigration phenomena in fully embedded copper interconnect structures

E. Zschech, M. Meyer, M. Herrmann, 2002 .

Through Silicon Via Reliability

J. Kraft, F. Schrank, F. Roger, 2012, IEEE Transactions on Device and Materials Reliability.

Taking SOI substrates and low-k dielectrics into high-volume microprocessor production

G. Burbach, D. Greenlaw, E. Langer, 2003, IEEE International Electron Devices Meeting 2003.

Ultra-Low-K dielectric degradation before breakdown

C. Boit, E. Langer, H. Ruelke, 2010, 2010 IEEE International Reliability Physics Symposium.

Extensive investigations of temperature influence on barrier integrity during reliability testing

H. Engelmann, C. Zistl, M. Meyer, 2008 .

Electromigration-induced copper interconnect degradation and failure: the role of microstructure

E. Zschech, M. Meyer, E. Langer, 2005, Proceedings of the 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005..

Micromechanical robustness tests of 28nm BEOL layer stacks

E. Langer, H. Geisler, 2015, 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits.

Conduction and material transport phenomena of degradation in electrically stressed ultra low-k dielectric before breakdown

C. Boit, A. Fissel, E. Langer, 2012 .

Effect of mass transport along interfaces and grain boundaries on copper interconnect degradation

Ehrenfried Zschech, Eckhard Langer, E. Zschech, 2004 .

Stress evolution on tungsten thin-film of an open through silicon via technology

E. Langer, H. Ceric, A. Singulani, 2013, Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Impact of bosch scallops dimensions on stress of an open through Silicon Via technology

L. Filipovic, E. Langer, H. Ceric, 2013, 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

Effects of Bosch scallops on metal layer stress of an open Through Silicon Via technology

E. Langer, H. Ceric, A. P. Singulani, 2013, 2013 IEEE International Reliability Physics Symposium (IRPS).

Physical failure analysis in semiconductor industry—challenges of the copper interconnect process

Ehrenfried Zschech, Kornelia Dittmar, Eckhard Langer, 2002 .