H. Fan
发表
P. Chan,
M. Yuen,
H. Fan,
2005
.
Matthew Ming Fai Yuen,
Haibo Fan,
M. Yuen,
2012
.
Cell K. Y. Wong,
M. Yuen,
H. Fan,
2009,
2009 59th Electronic Components and Technology Conference.
M. Yuen,
H. Fan,
C. Wong,
2008,
2008 International Conference on Electronic Packaging Technology & High Density Packaging.
H. Fan,
Haibin Chen,
Civen Li,
2021,
2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
M. Yuen,
H. Fan,
Kai Zhang,
2012
.
M. Yuen,
H. Fan,
2008
.
M. Yuen,
H. Fan,
Kai Zhang,
2007,
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.
M. Yuen,
D. Xiao,
H. Fan,
2011,
2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
H. Fan,
Zhou Zhou,
2022,
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
M. Yuen,
H. Fan,
Kai Zhang,
2009
.
Matthew Ming Fai Yuen,
Haibo Fan,
M. Yuen,
2007
.
Haibo Fan,
M. Yuen,
H. Fan,
2008,
IEEE Transactions on Components and Packaging Technologies.
Cell K. Y. Wong,
M. Yuen,
H. Fan,
2006
.
M. Yuen,
H. Fan,
C. Wong,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
Jingshen Wu,
H. Fan,
Haibin Chen,
2022,
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
K. Zhang,
M. Yuen,
D. Xiao,
2006,
56th Electronic Components and Technology Conference 2006.
M. Yuen,
H. Fan,
E. Chan,
2010
.
Matthew Ming Fai Yuen,
Haibo Fan,
Cell K. Y. Wong,
2006
.
M. Yuen,
H. Fan,
2013
.
Richard van Silfhout,
Thijs Viegers,
M. Yuen,
2009,
EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
Cell K. Y. Wong,
Matthew M. F. Yuen,
M. Yuen,
2009,
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
M. Yuen,
H. Fan,
C. Wong,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
Matthew Ming Fai Yuen,
Philip C. H. Chan,
Haibo Fan,
2002,
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).
H. Fan,
Haibin Chen,
Peilun Yao,
2023,
International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems.
M. Yuen,
H. Fan,
Kai Zhang,
2006,
2006 International Conference on Electronic Materials and Packaging.
M. Yuen,
Zhigang Li,
H. Fan,
2010,
The Journal of chemical physics.
M. Yuen,
H. Fan,
Kai Zhang,
2006,
2006 International Conference on Electronic Materials and Packaging.
Kai Zhang,
Haibo Fan,
M. Yuen,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
M. Yuen,
H. Fan,
C. Wong,
2004,
5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.
M. Yuen,
H. Fan,
E. Chan,
2006,
EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.
M. Yuen,
H. Fan,
C. Wong,
2005,
EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..
M. Yuen,
H. Fan,
2003
.
H. Fan,
Haibin Chen,
Zhiwen Li,
2020,
International Conference on Electronic Packaging Technology.
Artur Wymyslowski,
Matthew Ming Fai Yuen,
Nancy Iwamoto,
2012
.
Cell K. Y. Wong,
M. Yuen,
H. Fan,
2007
.
H. Fan,
Haibin Chen,
Jun Yang,
2020,
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).
Jingshen Wu,
H. Fan,
Haibin Chen,
2018,
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Jingshen Wu,
H. Fan,
Haibin Chen,
2016,
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
M. Yuen,
N. Iwamoto,
H. Fan,
2015
.
M. Yuen,
H. Fan,
E. Chan,
2010,
2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).
M. Yuen,
H. Fan,
E. Chan,
2012
.
Cell K. Y. Wong,
M. Yuen,
H. Fan,
2011
.