S. Lagrange

Self-annealing characterization of electroplated copper films

K. Maex, S. Brongersma, M. Judelewicz, 1999 .

A Controlled Deposition of Organic Contamination and the Removal with Ozone Based Cleanings

H. Bender, M. Heyns, T. Conard, 2001 .

Critical issues in post Cu CMP cleaning

M. Heyns, R. Vos, P. Mertens, 2000, Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130).

Mitigating risks and vulnerabilities in the energy-food-water nexus in developing countries

S. Lagrange, J. Wakeford, Florian Kroll, 2015 .

TWO-STEP ROOM TEMPERATURE GRAIN GROWTH IN ELECTROPLATED COPPER

G. Beyer, H. Bender, K. Maex, 1999 .