N. Kumbhat
发表
V. Sundaram,
Fuhan Liu,
R. Tummala,
2010,
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
V. Sundaram,
Fuhan Liu,
R. Tummala,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Choon Chowe Chen,
F. Bi,
N. Kumbhat,
2014,
2014 IEEE International Ultrasonics Symposium.
R. Tummala,
P. Gangidi,
P. Raj,
2013,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
V. Sundaram,
R. Tummala,
N. Kumbhat,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
V. Sundaram,
R. Tummala,
N. Kumbhat,
2011,
2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.
V. Sundaram,
R. Tummala,
R. Pucha,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Co-electrodeposited graphite and diamond-loaded solder nanocomposites as thermal interface materials
R. Tummala,
P. Raj,
N. Kumbhat,
2010,
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
N. Kumbhat,
2005
.
S. Bhattacharya,
P. Markondeya Raj,
R. Doraiswami,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
P. Jönsson,
N. Kumbhat,
L. Jonsson,
2006
.
Rao Tummala,
Venky Sundaram,
Sebastian Gottschall,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
Rao Tummala,
Fuhan Liu,
Madhavan Swaminathan,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Rao Tummala,
Fuhan Liu,
Venky Sundaram,
2010,
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).