T. Chai
发表
Xiaowu Zhang,
Lin Ji,
D. V. Sorono,
2013,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
C. Selvanayagam,
Xiaowu Zhang,
J. Lau,
2009,
IEEE Transactions on Advanced Packaging.
Tai Chong Chai,
Kripesh Vaidyanathan,
Chong Ser Choong,
2002,
Microelectron. Reliab..
X. R. Zhang,
Xiaowu Zhang,
Shan Gao,
2011
.
T. Chai,
A. Trigg,
H. Hsiao,
2015,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
C.S. Premachandran,
M. Iyer,
C. Premachandran,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
K. Vaidyanathan,
S.K.W. Seah,
C. Selvanayagam,
2008,
2008 58th Electronic Components and Technology Conference.
T. Chai,
Y. Wang,
T.C. Chai,
2004,
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).
Xiaowu Zhang,
T. Chai,
K. Biswas,
2008,
2008 10th Electronics Packaging Technology Conference.
Xiaowu Zhang,
C. Premachandran,
C. Choong,
2003,
53rd Electronic Components and Technology Conference, 2003. Proceedings..
F. Che,
T. Chai,
L. C. Wai,
2018,
IEEE Transactions on Device and Materials Reliability.
F. Che,
T. Chai,
L. C. Wai,
2015,
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
Xiaowu Zhang,
F. Che,
T. Chai,
2015,
Journal of Electronic Materials.
Xiaowu Zhang,
F. Che,
T. Chai,
2013,
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).
S. W. Ho,
T. Chai,
S. Chong,
2010,
2010 12th Electronics Packaging Technology Conference.
C. Premachandran,
K. Lim,
A. Tay,
2002,
4th Electronics Packaging Technology Conference, 2002..
Anand Asundi,
Zhaowei Zhong,
Tai Chong Chai,
2001,
International Symposium on Photonics and Applications.
V. N. Sekhar,
S. Balakumar,
S. Yoon,
2009
.
J. Lau,
T. Chai,
W.H. Zhu,
2008,
2008 58th Electronic Components and Technology Conference.
V. N. Sekhar,
S. Balakumar,
A. Tay,
2006,
2006 8th Electronics Packaging Technology Conference.
Xiaowu Zhang,
Tai Chong Chai,
Leong Ching Wai,
2012,
Microelectron. Reliab..
T. Chai,
L. C. Wai,
D. Vallett,
2015,
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
T. Lim,
Xiaowu Zhang,
G. Tang,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Xiaowu Zhang,
G. Tang,
T. Chai,
2019,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
T. Lim,
Xiaowu Zhang,
Zhaohui Chen,
2018,
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
Fa Xing Che,
Xiaowu Zhang,
Tai Chong Chai,
2008,
IEEE Transactions on Device and Materials Reliability.
Tai Chong Chai,
B. Cotterell,
T. Chai,
2006
.
Xiaowu Zhang,
T. Chai,
K. Biswas,
2008,
EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
Xiaowu Zhang,
T. Chai,
K. Biswas,
2007,
2007 9th Electronics Packaging Technology Conference.
Xiaowu Zhang,
T. Chai,
C. W. Chong,
2006,
2006 8th Electronics Packaging Technology Conference.
Xiaowu Zhang,
V. Kripesh,
N. Khan,
2010,
IEEE Transactions on Components and Packaging Technologies.
V. Kripesh,
Seung Wook Yoon,
A.G.K. Viswanath,
2008,
IEEE Transactions on Advanced Packaging.
John H. Lau,
V. Kripesh,
Shiguo Liu,
2009,
2009 59th Electronic Components and Technology Conference.
C. S. Premachandran,
Xiaowu Zhang,
T. C. Chai,
2001,
SPIE MOEMS-MEMS.
Tai Chong Chai,
Shiguo Liu,
Yue Ying Ong,
2011,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
F. Che,
T. Chai,
D. Ho,
2019,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Comprehensive Study of Thermal Impact on Warpage Behaviour of FOWLP with Different Die to Mold Ratio
T. Chai,
S. Chong,
W. Seit,
2021,
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Zhaohui Chen,
Hyun-Kee Chang,
T. Chai,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
S. W. Ho,
Yong Han,
T. Chai,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
T. Chai,
L. Ji,
Sharon Pei Siang Lim,
2022,
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Tai Chong Chai,
Ser Choong Chong,
Eva Wai Leong Ching,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
S. Lim,
T. Chai,
S. Chong,
2018,
Electronic Packaging Technology Conference.
S. Lim,
T. Chai,
S. Chong,
2020,
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).
Design and Optimization of Wafer-Level Compression Molding Process for One Chip Plus Multiple Decaps
Xiaowu Zhang,
Lin Bu,
Siowling Ho,
2015,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Lin Bu,
Sorono Dexter Velez,
Taichong Chai,
2013,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
T. Chai,
S. Chong,
H. Hsiao,
2021,
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
T. Chai,
S. Chong,
H. Hsiao,
2020,
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC).
S. W. Ho,
T. Chai,
S. Chong,
2013,
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).
Xiaowu Zhang,
Zhaohui Chen,
Boyu Zheng,
2013,
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).
Xiaowu Zhang,
T. Chai,
N. Jaafar,
2015,
2015 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC).
T. Chai,
L. Ji,
2021,
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
C. G. Koh,
T. Chai,
L. Wai,
2015,
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
Seung Wook Yoon,
A.G.K. Viswanath,
D. Witarsa,
2006,
56th Electronic Components and Technology Conference 2006.
V. Kripesh,
Seung Wook Yoon,
A.G.K. Viswanath,
2008,
IEEE Transactions on Advanced Packaging.
M. Iyer,
T. Chai,
P. Teo,
2002,
Electronic Components and Technology Conference.
J. Lau,
V. S. Rao,
T. Chai,
2009,
2009 59th Electronic Components and Technology Conference.
Xiaowu Zhang,
R. Murthy,
W.H. Zhu,
2008,
2008 58th Electronic Components and Technology Conference.