Yangyang Yan

发表

M. Koyanagi, Kang-wook Lee, T. Fukushima, 2016, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Qianwen Chen, Yueyang Chen, Yangyang Yan, 2014, Science China Technological Sciences.

Yingtao Ding, Chengbo Xue, Ziru Cai, 2018, IEEE Transactions on Device and Materials Reliability.

Zhiming Chen, Huikai Xie, Lei Xiao, 2022, IEEE Electron Device Letters.

Mitsu Koyanagi, Takafumi Fukushima, Yangyang Yan, 2015, 2015 International 3D Systems Integration Conference (3DIC).

Yangyang Yan, Ziyue Zhang, Zhiqiang Cheng, 2016, 2016 IEEE International 3D Systems Integration Conference (3DIC).

Liqiang Cao, Yangyang Yan, P. Sun, 2020, 2020 21st International Conference on Electronic Packaging Technology (ICEPT).

Yangyang Yan, Zhiming Chen, Yingtao Ding, 2016, IEEE Transactions on Electron Devices.

B. Liu, Zhiming Chen, Yangyang Yan, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

Liqiang Cao, Fengwei Dai, Yangyang Yan, 2020, 2020 21st International Conference on Electronic Packaging Technology (ICEPT).

Huikai Xie, Anrun Ren, Lei Xiao, 2023, Microsystems & nanoengineering.